发明申请
- 专利标题： SYSTEM, METHOD AND APPARATUS FOR ELIMINATING ADHESION LAYERS BETWEEN SUBSTRATES AND SOFT UNDERLAYERS IN PERPENDICULAR MEDIA
- 专利标题（中）： 衬底和软底层粘结层之间消除粘结层的系统，方法和装置
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申请号： US11930449申请日： 2007-10-31
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公开(公告)号： US20090110962A1公开(公告)日： 2009-04-30
- 发明人: Hong Deng , Yoshihiro Ikeda
- 申请人： Hong Deng , Yoshihiro Ikeda
- 申请人地址： NL Amsterdam
- 专利权人： Hitachi Global Storage Technologies Netherlands BV
- 当前专利权人： Hitachi Global Storage Technologies Netherlands BV
- 当前专利权人地址： NL Amsterdam
- 主分类号： G11B5/62
- IPC分类号： G11B5/62 ; B05D1/36 ; G11B5/82 ; B32B7/00
摘要：
A perpendicular media is formed without an adhesion layer between the substrate and soft underlayer (SUL) to reduce the cost of fabrication. The thickness of the SUL is reduced to less than 50 nm to increase the film adhesion strength between the substrate and SUL. The perpendicular media comprises only a substrate, the SUL, an exchange break layer, a recording layer, and a protective overcoat.
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