发明申请
- 专利标题: METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- 专利标题(中): 制造半导体器件的方法
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申请号: US12254560申请日: 2008-10-20
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公开(公告)号: US20090111198A1公开(公告)日: 2009-04-30
- 发明人: Saishi FUJIKAWA , Kunio HOSOYA , Yoko CHIBA
- 申请人: Saishi FUJIKAWA , Kunio HOSOYA , Yoko CHIBA
- 申请人地址: JP Atsugi-shi
- 专利权人: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人地址: JP Atsugi-shi
- 优先权: JP2007-275782 20071023
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L33/00
摘要:
A manufacturing method of the present invention includes a process using a first multi-tone mask, in which a first conductive layer in which a transparent conductive layer and a metal layer are stacked over a substrate, a gate electrode formed of a first conductive layer, and a pixel electrode formed of a single layer of the transparent conductive layer are formed, a process using a second multi-tone mask, in which a contact hole to the pixel electrode, and an island of an i-type semiconductor layer and an n+ type semiconductor layer are formed after a gate insulating film, the i-type semiconductor layer, and the n+ type semiconductor layer are formed, a process using a third photomask, in which a source electrode and a drain electrode are formed after a second conductive layer is formed, and a process using a fourth photomask, in which an opening region is formed after a protective film is deposited.
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