发明申请
- 专利标题： COATED LEAD FRAME
- 专利标题（中）： 涂层铅框架
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申请号： US12129686申请日： 2008-05-30
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公开(公告)号： US20090111220A1公开(公告)日： 2009-04-30
- 发明人: Chao Wang , Qing Chun He , Zhe Li , Zhijie Wang , Dehong Ye
- 申请人： Chao Wang , Qing Chun He , Zhe Li , Zhijie Wang , Dehong Ye
- 申请人地址： US TX Austin
- 专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人地址： US TX Austin
- 优先权： CN200710184806.0 20071029
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L23/49 ; B05D3/02 ; H01L23/495
摘要：
A lead frame having a coating of organic compounds on its lead fingers prevents tin and flux from contaminating the lead fingers after die attach. The coating is removed prior to wire bonding. The coating allows for reliable second bonds (bond between wires and lead fingers) to be formed, decreasing the likelihood of non-stick and improving wire peel strength.
公开/授权文献
- US07887928B2 Coated lead frame 公开/授权日：2011-02-15