Invention Application
- Patent Title: CONDUCTIVE PASTE AND PRINTED CIRCUIT BOARD USING THE SAME
- Patent Title (中): 导电胶和印刷电路板使用相同
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Application No.: US12178285Application Date: 2008-07-23
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Publication No.: US20090114425A1Publication Date: 2009-05-07
- Inventor: Eung-Suek LEE , Seung-Hyun BAIK , Young-Jin KIM , Young-Seok OH , Jae-Boong CHOI , Dae-Woo SUH , Je-Gwang YOO , Chang-Sup RYU , Jun-Oh HWANG , Jee-Soo MOK
- Applicant: Eung-Suek LEE , Seung-Hyun BAIK , Young-Jin KIM , Young-Seok OH , Jae-Boong CHOI , Dae-Woo SUH , Je-Gwang YOO , Chang-Sup RYU , Jun-Oh HWANG , Jee-Soo MOK
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.,SUNGKYUNKWAN UNIVERSITY
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.,SUNGKYUNKWAN UNIVERSITY
- Priority: KR10-2007-0113437 20071107
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01B1/14
Abstract:
A conductive paste and a printed circuit board using the conductive paste are disclosed. The conductive paste including conductive particles and carbon nanotubes according to the invention, can improve an electrical conductivity of the conductive paste.
Information query
