发明申请
US20090117488A1 COMPOUND, POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
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化合物,阳性电阻组合物和电阻图案形成方法
- 专利标题: COMPOUND, POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
- 专利标题(中): 化合物,阳性电阻组合物和电阻图案形成方法
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申请号: US11994602申请日: 2006-06-30
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公开(公告)号: US20090117488A1公开(公告)日: 2009-05-07
- 发明人: Takako Hirosaki , Daiju Shiono , Taku Hirayama , Hideo Hada
- 申请人: Takako Hirosaki , Daiju Shiono , Taku Hirayama , Hideo Hada
- 申请人地址: JP KAWASAKI-SHI
- 专利权人: TOKYO CHKA KOGYO CO., LTD
- 当前专利权人: TOKYO CHKA KOGYO CO., LTD
- 当前专利权人地址: JP KAWASAKI-SHI
- 优先权: JP2005-196132 20050705
- 国际申请: PCT/JP2006/313103 WO 20060630
- 主分类号: G03F7/004
- IPC分类号: G03F7/004 ; C07C69/76 ; G03F7/26
摘要:
The present invention provides a positive resist composition and a resist pattern forming method that are capable of forming a resist pattern with a reduced level of roughness. The positive resist composition includes the compound represented by the general formula (I) below. The present invention also provides the resist pattern forming method using the positive resist composition above. [wherein, in formula (I), R11 and R12 each represents, independently, an alkyl group of 1 to 10 carbon atoms or an aromatic hydrocarbon group, and may include a hetero atom in the structure thereof; R21 to R24 each represents, independently, a hydrogen atom or an acid dissociable, dissolution inhibiting group, and two of the R21 to R24 represents a hydrogen atom and the others represents an acid dissociable, dissolution inhibiting group; X is a group represented by general formulas (Ia) or (Ib) below].
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