发明申请
- 专利标题: ELECTRONIC COMPONENT MOUNTING APPARATUS
- 专利标题(中): 电子元件安装设备
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申请号: US12349249申请日: 2009-01-06
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公开(公告)号: US20090119912A1公开(公告)日: 2009-05-14
- 发明人: Akio Watanabe , Akihiro Kawai , Tetsuji Ono , Makio Kameda , Kazuyoshi Oyama
- 申请人: Akio Watanabe , Akihiro Kawai , Tetsuji Ono , Makio Kameda , Kazuyoshi Oyama
- 申请人地址: JP Ora-Gun
- 专利权人: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
- 当前专利权人: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
- 当前专利权人地址: JP Ora-Gun
- 优先权: JP2005-192116 20050630
- 主分类号: H05K3/30
- IPC分类号: H05K3/30
摘要:
This invention is directed to prevention of reduction of a pickup rate of an electronic component when a component feeding unit is dismounted from a feeder base and mounted back thereon. A CPU sends a feeding command to a component feeding unit feeding an electronic component belonging to a first step number, and drives a servomotor and a drive motor of the feeding unit to perform a component feeding operation and so on. After then, when the CPU judges that the feeding unit is dismounted from the feeder base and mounted back thereon, the CPU drives a X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing to the image. A correction value based on this recognition result is stored in a RAM, the X axis drive motor and the Y axis drive motor are driven taking this correction value into account, a vertical axis drive motor is driven, and a suction nozzle lowers and picks up the electronic component.
公开/授权文献
- US08181337B2 Electronic component mounting method 公开/授权日:2012-05-22
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