ELECTRONIC COMPONENT MOUNTING APPARATUS
    1.
    发明申请
    ELECTRONIC COMPONENT MOUNTING APPARATUS 有权
    电子元件安装设备

    公开(公告)号:US20100186223A1

    公开(公告)日:2010-07-29

    申请号:US12727349

    申请日:2010-03-19

    IPC分类号: H05K13/04

    摘要: The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

    摘要翻译: 本发明涉及即使使用连接带连接的存储带的接缝处的部件存储部分中的电子部件的可靠的拾取操作,并且防止电子部件的拾取速率的降低。 CPU向组件供给单元发送进给命令以执行部件供给操作等。 然后,当CPU判断连接带到达拾取位置时,CPU驱动X轴驱动电动机和Y轴驱动电动机将板识别摄像机移动到馈送单元的拾取位置,摄像机拍摄图像 存储带的存储部分,以及识别处理装置执行识别处理。 将基于该识别处理的结果的校正值存储在RAM中,并且考虑到该校正值移动吸嘴并降低拾取电子部件。

    Electronic component mounting apparatus
    2.
    发明申请
    Electronic component mounting apparatus 有权
    电子元件安装装置

    公开(公告)号:US20070130756A1

    公开(公告)日:2007-06-14

    申请号:US11605471

    申请日:2006-11-29

    IPC分类号: B23P21/00

    摘要: The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

    摘要翻译: 本发明涉及即使使用连接带连接的存储带的接缝处的部件存储部分中的电子部件的可靠的拾取操作,并且防止电子部件的拾取速率的降低。 CPU向组件供给单元发送进给命令以执行部件供给操作等。 然后,当CPU判断连接带到达拾取位置时,CPU驱动X轴驱动电动机和Y轴驱动电动机将板识别摄像机移动到馈送单元的拾取位置,摄像机拍摄图像 存储带的存储部分,以及识别处理装置执行识别处理。 将基于该识别处理的结果的校正值存储在RAM中,并且考虑到该校正值移动吸嘴并降低拾取电子部件。

    Electronic component mounting apparatus
    3.
    发明授权
    Electronic component mounting apparatus 有权
    电子元件安装装置

    公开(公告)号:US07712208B2

    公开(公告)日:2010-05-11

    申请号:US11605471

    申请日:2006-11-29

    IPC分类号: B23P19/00

    摘要: The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

    摘要翻译: 本发明涉及即使使用连接带连接的存储带的接缝处的部件存储部分中的电子部件的可靠的拾取操作,并且防止电子部件的拾取速率的降低。 CPU向组件供给单元发送进给命令以执行部件供给操作等。 然后,当CPU判断连接带到达拾取位置时,CPU驱动X轴驱动电动机和Y轴驱动电动机将板识别摄像机移动到馈送单元的拾取位置,摄像机拍摄图像 存储带的存储部分,以及识别处理装置执行识别处理。 将基于该识别处理的结果的校正值存储在RAM中,并且考虑到该校正值移动吸嘴并降低拾取电子部件。

    Electronic component mounting apparatus
    4.
    发明申请
    Electronic component mounting apparatus 审中-公开
    电子元件安装装置

    公开(公告)号:US20070011869A1

    公开(公告)日:2007-01-18

    申请号:US11478434

    申请日:2006-06-30

    IPC分类号: B23P19/00

    摘要: This invention is directed to prevention of reduction of a pickup rate of an electronic component when a component feeding unit is dismounted from a feeder base and mounted back thereon. A CPU sends a feeding command to a component feeding unit feeding an electronic component belonging to a first step number, and drives a servomotor and a drive motor of the feeding unit to perform a component feeding operation and so on. After then, when the CPU judges that the feeding unit is dismounted from the feeder base and mounted back thereon, the CPU drives a X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing to the image. A correction value based on this recognition result is stored in a RAM, the X axis drive motor and the Y axis drive motor are driven taking this correction value into account, a vertical axis drive motor is driven, and a suction nozzle lowers and picks up the electronic component.

    摘要翻译: 本发明涉及防止当将元件供给单元从供料器基座上拆下并安装在其上时降低电子元件的拾取速度。 CPU向馈送属于第一步骤的电子部件的部件供给部发送进给命令,驱动供给部的伺服马达和驱动马达进行部件供给动作等。 然后,当CPU判断进给单元从进料器基座上卸下并安装在其上时,CPU驱动X轴驱动电机和Y轴驱动电机将板识别摄像机移动到进给单元的拾取位置 相机拍摄存储带的存储部分的图像,并且识别处理装置对图像执行识别处理。 基于该识别结果的校正值存储在RAM中,考虑到该修正值来驱动X轴驱动电动机和Y轴驱动电动机,驱动垂直轴驱动电动机,吸嘴降低并取出 电子元件。

    Electronic component mounting apparatus
    5.
    发明授权
    Electronic component mounting apparatus 有权
    电子元件安装装置

    公开(公告)号:US08336195B2

    公开(公告)日:2012-12-25

    申请号:US12727349

    申请日:2010-03-19

    IPC分类号: B23P19/00

    摘要: The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

    摘要翻译: 本发明涉及即使使用连接带连接的存储带的接缝处的部件存储部分中的电子部件的可靠的拾取操作,并且防止电子部件的拾取速率的降低。 CPU向组件供给单元发送进给命令以执行部件供给操作等。 然后,当CPU判断连接带到达拾取位置时,CPU驱动X轴驱动电动机和Y轴驱动电动机将板识别摄像机移动到馈送单元的拾取位置,摄像机拍摄图像 存储带的存储部分,以及识别处理装置执行识别处理。 将基于该识别处理的结果的校正值存储在RAM中,并且考虑到该校正值移动吸嘴并降低拾取电子部件。

    Electronic component mounting method
    6.
    发明授权
    Electronic component mounting method 有权
    电子元件安装方法

    公开(公告)号:US08181337B2

    公开(公告)日:2012-05-22

    申请号:US12349249

    申请日:2009-01-06

    IPC分类号: H01R43/00

    摘要: A method of mounting electronic components on a printed board includes providing a storage tape including a first portion and a second portion that are connected by a connection tape and containing electronic components stored therein, advancing the storage tape so that an electronic component is advanced to a component pickup position where electronic components are picked up by a suction nozzle, picking up the advanced electronic component at the component pickup position by the suction nozzle, and mounting the picked up electronic component on a printed board. The advancing of the storage tape, the picking up of the electronic component and the mounting of the electronic component are repeated, and the component pickup position is adjusted when the second portion of the storage tape is advanced to the component pickup position.

    摘要翻译: 将电子部件安装在印刷电路板上的方法包括提供包括第一部分和第二部分的存储带,所述第一部分和第二部分通过连接带连接并包含存储在其中的电子部件,使存储带前进,使得电子部件前进到 部件拾取位置,其中电子部件由吸嘴吸取,通过吸嘴从部件拾取位置拾起高级电子部件,并将拾取的电子部件安装在印刷电路板上。 重复存储带的推进,电子部件的拾取和电子部件的安装,并且当存储带的第二部分前进到部件拾取位置时,调整部件拾取位置。

    ELECTRONIC COMPONENT MOUNTING APPARATUS
    7.
    发明申请
    ELECTRONIC COMPONENT MOUNTING APPARATUS 有权
    电子元件安装设备

    公开(公告)号:US20090119912A1

    公开(公告)日:2009-05-14

    申请号:US12349249

    申请日:2009-01-06

    IPC分类号: H05K3/30

    摘要: This invention is directed to prevention of reduction of a pickup rate of an electronic component when a component feeding unit is dismounted from a feeder base and mounted back thereon. A CPU sends a feeding command to a component feeding unit feeding an electronic component belonging to a first step number, and drives a servomotor and a drive motor of the feeding unit to perform a component feeding operation and so on. After then, when the CPU judges that the feeding unit is dismounted from the feeder base and mounted back thereon, the CPU drives a X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing to the image. A correction value based on this recognition result is stored in a RAM, the X axis drive motor and the Y axis drive motor are driven taking this correction value into account, a vertical axis drive motor is driven, and a suction nozzle lowers and picks up the electronic component.

    摘要翻译: 本发明涉及防止当将元件供给单元从供料器基座上拆下并安装在其上时降低电子元件的拾取速度。 CPU向馈送属于第一步骤的电子部件的部件供给部发送进给命令,驱动供给部的伺服马达和驱动马达进行部件供给动作等。 然后,当CPU判断进给单元从进料器基座上卸下并安装在其上时,CPU驱动X轴驱动电机和Y轴驱动电机将板识别摄像机移动到进给单元的拾取位置 相机拍摄存储带的存储部分的图像,并且识别处理装置对图像执行识别处理。 基于该识别结果的校正值存储在RAM中,考虑到该修正值来驱动X轴驱动电动机和Y轴驱动电动机,驱动垂直轴驱动电动机,吸嘴降低并取出 电子元件。

    Electronic component mounting method
    8.
    发明授权
    Electronic component mounting method 有权
    电子元件安装方法

    公开(公告)号:US07721424B2

    公开(公告)日:2010-05-25

    申请号:US11340866

    申请日:2006-01-27

    IPC分类号: H05K3/30

    摘要: The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.

    摘要翻译: 本发明旨在防止在不降低印刷电路板制造速度的情况下安装适当的电子部件的操作和提高可用性的干扰。 通过吸嘴吸附保持的电子部件的吸引状态由线传感器单元检测。 当检测结果表明存在不正确的电子部件时,处理不正确的电子部件,并且在处置之后,部件识别照相机拍摄作为检测结果被判定为正确的电子部件的图像,并且识别处理装置执行识别 处理。 当识别结果表明存在不正确的电子部件时,处理不正确的电子部件,并且在处理之后,仅将作为识别的结果判定为合适的电子部件安装在印刷电路板上。

    Electronic component mounting method and electronic component mounting apparatus
    9.
    发明申请
    Electronic component mounting method and electronic component mounting apparatus 有权
    电子部件安装方法和电子部件安装装置

    公开(公告)号:US20060185162A1

    公开(公告)日:2006-08-24

    申请号:US11340866

    申请日:2006-01-27

    IPC分类号: H05K3/30 B23P19/00

    摘要: The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.

    摘要翻译: 本发明旨在防止在不降低印刷电路板制造速度的情况下安装适当的电子部件的操作和提高可用性的干扰。 通过吸嘴吸附保持的电子部件的吸引状态由线传感器单元检测。 当检测结果表明存在不正确的电子部件时,处理不正确的电子部件,并且在处置之后,部件识别照相机拍摄作为检测结果被判定为正确的电子部件的图像,并且识别处理装置执行识别 处理。 当识别结果表明存在不正确的电子部件时,处理不正确的电子部件,并且在处理之后,仅将作为识别的结果判定为合适的电子部件安装在印刷电路板上。

    Method of mounting electronic component
    10.
    发明授权
    Method of mounting electronic component 有权
    安装电子元器件的方法

    公开(公告)号:US08186047B2

    公开(公告)日:2012-05-29

    申请号:US12434500

    申请日:2009-05-01

    IPC分类号: H05K3/30

    摘要: The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.

    摘要翻译: 本发明旨在防止在不降低印刷电路板制造速度的情况下安装适当的电子部件的操作和提高可用性的干扰。 通过吸嘴吸附保持的电子部件的吸引状态由线传感器单元检测。 当检测结果表明存在不正确的电子部件时,处理不正确的电子部件,并且在处置之后,部件识别照相机拍摄作为检测结果被判定为正确的电子部件的图像,并且识别处理装置执行识别 处理。 当识别结果表明存在不正确的电子部件时,处理不正确的电子部件,并且在处理之后,仅将作为识别的结果判定为合适的电子部件安装在印刷电路板上。