发明申请
- 专利标题： SEMICONDUCTOR DEVICE WITH BONDING PAD
- 专利标题（中）： 具有粘接垫的半导体器件
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申请号： US12354171申请日： 2009-01-15
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公开(公告)号： US20090124073A1公开(公告)日： 2009-05-14
- 发明人: Ming-Chyi Liu , Yuan-Hung Liu , Gwo-Yuh Shiau , Yuan-Chih Hsieh , Chi-Hsin Lo , Chia-Shiung Tsai
- 申请人： Ming-Chyi Liu , Yuan-Hung Liu , Gwo-Yuh Shiau , Yuan-Chih Hsieh , Chi-Hsin Lo , Chia-Shiung Tsai
- 申请人地址： TW Hsin-Chu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L21/768
- IPC分类号： H01L21/768
摘要：
A method for forming a semiconductor device with a bonding pad is disclosed. A first substrate having a device area and a bonding area is provided, wherein the first substrate has an upper surface and a bottom surface. Semiconductor elements are formed on the upper surface of the first substrate in the device area. A first inter-metal dielectric layer is formed on the upper surface of the substrate in the bonding area. A lowermost metal pattern is formed in the first inter-metal dielectric layer, wherein the lowermost metal pattern serves as the bonding pad. An opening through the first substrate is formed to expose the lowermost metal pattern.
公开/授权文献
- US07883917B2 Semiconductor device with bonding pad 公开/授权日：2011-02-08
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