发明申请
- 专利标题: ETCHING SOLUTION COMPOSITION FOR METAL FILMS
- 专利标题(中): 蚀刻金属膜的溶液组成
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申请号: US12352020申请日: 2009-01-12
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公开(公告)号: US20090124091A1公开(公告)日: 2009-05-14
- 发明人: Kazuhiro Fujikawa , Tsuguhiro Tago
- 申请人: Kazuhiro Fujikawa , Tsuguhiro Tago
- 申请人地址: JP Tokyo JP Osaka JP Niigata
- 专利权人: Kanto Kagaku Kabushiki Kaisha,Sanyo Electric Co., Ltd.,Sanyo Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Kanto Kagaku Kabushiki Kaisha,Sanyo Electric Co., Ltd.,Sanyo Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: JP Tokyo JP Osaka JP Niigata
- 优先权: JP2003-404439 20031203
- 主分类号: H01L21/306
- IPC分类号: H01L21/306 ; B44C1/22
摘要:
The present invention aims to provide an etching solution composition which enables to etch a metal film in a controllable manner, form a desired definite tapered shape, and obtain a smooth surface without causing etching solution exudation trace. Said problems have been solved by the present invention, which is an etching solution composition for etching metal films containing one or more surfactants selected from the group consisting of alkyl sulfate or perfluoroalkenyl phenyl ether sulfonic acid and the salts thereof.
公开/授权文献
- US08557711B2 Etching solution composition for metal films 公开/授权日:2013-10-15