发明申请
- 专利标题： DIE-TO-ROBOT ALIGNMENT FOR DIE-TO-SUBSTRATE BONDING
- 专利标题（中）： 用于直接到基板接合的机器人对准
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申请号： US12248204申请日： 2008-10-09
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公开(公告)号： US20090126851A1公开(公告)日： 2009-05-21
- 发明人: Damon K. Cox , Todd J. Egan , Michael X. Yang , Jeffrey C. Hudgens
- 申请人： Damon K. Cox , Todd J. Egan , Michael X. Yang , Jeffrey C. Hudgens
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 主分类号： B32B37/12
- IPC分类号： B32B37/12
摘要：
A method, a system and a computer readable medium having a set of instructions stored thereon for die-to-robot alignment for die-to-substrate bonding are described. First, a robot is aligned with a substrate to provide a pre-aligned robot. Next, a die is aligned with the pre-aligned robot to provide a robot-aligned die. Finally, the robot-aligned die is bonded to a region of the substrate. The substrate is held stationary immediately following the aligning of the robot with the substrate and at least until the robot-aligned die is bonded to the region of the substrate.
公开/授权文献
- US08123881B2 Die-to-robot alignment for die-to-substrate bonding 公开/授权日：2012-02-28
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