Invention Application
US20090127661A1 NITRIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
审中-公开
氮化物半导体器件及其制造方法
- Patent Title: NITRIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 氮化物半导体器件及其制造方法
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Application No.: US12271946Application Date: 2008-11-17
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Publication No.: US20090127661A1Publication Date: 2009-05-21
- Inventor: Katsuomi Shiozawa , Kyozo Kanamoto , Toshiyuki Oishi , Hiroshi Kurokawa , Kazushige Kawasaki , Shinji Abe , Hitoshi Sakuma
- Applicant: Katsuomi Shiozawa , Kyozo Kanamoto , Toshiyuki Oishi , Hiroshi Kurokawa , Kazushige Kawasaki , Shinji Abe , Hitoshi Sakuma
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2007-300004 20071120
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L21/31

Abstract:
Semiconductor devices, in particular nitride semiconductor devices for use in the manufacture of laser diodes, prevent peeling-off of the electrode, and at the same time reduces the complexity of processes and a reduction in yield. A nitride semiconductor device according to the invention includes a P-type nitride semiconductor layer with a ridge on its surface, an SiO2 film covering at least the side face of the ridge, an adherence layer formed on a surface of the SiO2 film and composed mainly of silicon, and a P-type electrode formed on the upper surface of the ridge and on a surface of the adherence layer.
Information query
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