发明申请
- 专利标题： Multi-Terminal Package Assembly For Semiconductor Devices
- 专利标题（中）： 半导体器件的多端子封装组件
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申请号： US11944281申请日： 2007-11-21
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公开(公告)号： US20090127677A1公开(公告)日： 2009-05-21
- 发明人: Jocel P. Gomez
- 申请人： Jocel P. Gomez
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/56
摘要：
Semiconductor packages that contain leads with multiple terminals are described. The leads have a side terminal that can extend between a top terminal and a bottom terminal. The multiple terminals in the leads allow the semiconductor package to be connected to more than one external substrate and give the package multiple land pattern options. The semiconductor package can contain one or more dies that are connected to a lead frame in the package without the use of a clip. The back side of the die may be externally exposed from the package to help dissipate heat.
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