发明申请
- 专利标题： PACKAGE, SUBASSEMBLY AND METHODS OF MANUFACTURING THEREOF
- 专利标题（中）： 包装，分包及其制造方法
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申请号： US12282653申请日： 2006-06-22
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公开(公告)号： US20090127702A1公开(公告)日： 2009-05-21
- 发明人: Ronald Dekker , Theodorus Martinus Michielsen , Eduard Johannes Meijer
- 申请人： Ronald Dekker , Theodorus Martinus Michielsen , Eduard Johannes Meijer
- 申请人地址： NL Eindhoven
- 专利权人： KONINKLIJKE PHILIPS ELECTRONICS, N.V.
- 当前专利权人： KONINKLIJKE PHILIPS ELECTRONICS, N.V.
- 当前专利权人地址： NL Eindhoven
- 优先权： EP05105830.3 20050629
- 国际申请： PCT/IB2006/052034 WO 20060622
- 主分类号： H01L23/36
- IPC分类号： H01L23/36 ; H01L21/768
摘要：
The package (100) of the invention comprises at least one semiconductor device (30) provided with bond pads (32); an encapsulation (40), an interconnect element (20) and a heatsink (90). This element comprises a system of electrical interconnects (12) and is at least substantially covered by a thermally conductive, electrically insulating layer (11) at a first side (1) and that is provided with an electric isolation (13) at a second side (2), such that the isolation (13) and the thermally conducting layer (11) electrically isolate the electrical interconnects (12) from each other. At least one component of the encapsulation (40) and the heatsink (90) has an interface with the interconnect element (20), which interlace extends over substantially the complete side (1,2) to which the said component (40,90) is attached.
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