公开(公告)号：US08105873B2

公开(公告)日：2012-01-31

申请号：US12878066

申请日：2010-09-09

申请人： Ronald Dekker ,  Theodorus Martinus Michielsen ,  Antoon Marie Henrie Tombeur

发明人： Ronald Dekker ,  Theodorus Martinus Michielsen ,  Antoon Marie Henrie Tombeur

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/4985 ,  H01L23/49855 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01Q1/38 ,  H01Q23/00 ,  Y10T29/49124 ,  H01L2924/00

摘要： Provided is a flexible device (100) having an integrated circuit (5) and an antenna (6) which is incorporated or directly coupled to the interconnect structure of the integrated circuit (5). An electrically insulating or dielectric layer (4) is present as support layer for both antenna (6) and integrated circuit (5). Preferably the substrate (10) is removed at non-silicon areas (10B) outside the active areas (10A) of the integrated circuit (5). This removal can be combined with the use of a substrate of monocrystalline silicon. The flexible device is very suitable for integration in identification labels and security paper, and can be manufactured using a temporarily attached carrier substrate.

摘要翻译： 提供了具有集成电路（5）和天线（6）的柔性装置（100），天线（6）并入或直接耦合到集成电路（5）的互连结构。 电绝缘或电介质层（4）作为天线（6）和集成电路（5）的支撑层而存在。 优选地，在集成电路（5）的有源区（10A）之外的非硅区（10B）处去除衬底（10）。 这种去除可以与使用单晶硅的衬底组合。 灵活的装置非常适用于识别标签和安全纸的集成，并可以使用临时附着的载体基板制造。

公开(公告)号：US20100328028A1

公开(公告)日：2010-12-30

申请号：US12878066

申请日：2010-09-09

申请人： Ronald Dekker ,  Theodorus Martinus Michielsen ,  Antoon Marie Henrie Tombeur ,  Pieter Werner Hooijmans

发明人： Ronald Dekker ,  Theodorus Martinus Michielsen ,  Antoon Marie Henrie Tombeur ,  Pieter Werner Hooijmans

IPC分类号： G06F7/04 ,  H05K1/00 ,  H04Q5/22

CPC分类号： H01L21/6835 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/4985 ,  H01L23/49855 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01Q1/38 ,  H01Q23/00 ,  Y10T29/49124 ,  H01L2924/00

摘要： Provided is a flexible device (100) having an integrated circuit (5) and an antenna (6) which is incorporated or directly coupled to the interconnect structure of the integrated circuit (5). An electrically insulating or dielectric layer (4) is present as support layer for both antenna (6) and integrated circuit (5). Preferably the substrate (10) is removed at non-silicon areas (10B) outside the active areas (10A) of the integrated circuit (5). This removal can be combined with the use of a substrate of monocrystalline silicon. The flexible device is very suitable for integration in identification labels and security paper, and can be manufactured using a temporarily attached carrier substrate.

摘要翻译： 提供了具有集成电路（5）和天线（6）的柔性装置（100），天线（6）并入或直接耦合到集成电路（5）的互连结构。 电绝缘或电介质层（4）作为天线（6）和集成电路（5）的支撑层而存在。 优选地，在集成电路（5）的有源区（10A）之外的非硅区（10B）处去除衬底（10）。 这种去除可以与使用单晶硅的衬底组合。 灵活的装置非常适用于识别标签和安全纸的集成，并可以使用临时附着的载体基板制造。

公开(公告)号：US07845378B2

公开(公告)日：2010-12-07

申请号：US11773149

申请日：2007-07-03

申请人： Henricus Godefridus Rafael Maas ,  Theodorus Martinus Michielsen ,  Richard Jozef Maria Waelen

发明人： Henricus Godefridus Rafael Maas ,  Theodorus Martinus Michielsen ,  Richard Jozef Maria Waelen

IPC分类号： B29C65/02

CPC分类号： C09J5/06 ,  C09J2400/143

摘要： A method for bonding two plate-shaped objects (5) with an adhesive which is cured by ultraviolet light irradiation and by heating. The two plate-shaped objects (5) with the adhesive in between are transported into a cure chamber (11) comprising an ultraviolet lamp (12) and a heating element (13). A movable heat-shielding member (3) is temporary present between the objects (5) and the heating element (13) during at least the first part of the irradiation treatment. Preferably, the heat-shielding member (3) is positioned outside the cure chamber (11) during a part of the cure treatment.

摘要翻译： 一种将两个板状物体（5）与通过紫外线照射和加热固化的粘合剂接合的方法。 具有粘合剂的两个板状物体（5）被输送到包括紫外灯（12）和加热元件（13）的固化室（11）中。 在照射处理的至少第一部分期间，可移动的热屏蔽构件（3）临时存在于物体（5）和加热元件（13）之间。 优选地，在固化处理的一部分期间，热屏蔽构件（3）位于固化室（11）的外部。

公开(公告)号：US20100164079A1

公开(公告)日：2010-07-01

申请号：US11993266

申请日：2006-06-23

申请人： Ronald Dekker ,  Marc Andre De Samber ,  Wilhelmus Hendrikus De Haas ,  Theodorus Martinus Michielsen ,  Franciscus Adrianus Cornelis Maria Schoofs ,  Nicolaas Johannes Anthonius Van Veen

发明人： Ronald Dekker ,  Marc Andre De Samber ,  Wilhelmus Hendrikus De Haas ,  Theodorus Martinus Michielsen ,  Franciscus Adrianus Cornelis Maria Schoofs ,  Nicolaas Johannes Anthonius Van Veen

IPC分类号： H01L23/488 ,  H01L21/56 ,  H01L23/28

CPC分类号： H01L24/16 ,  H01L21/4846 ,  H01L21/568 ,  H01L21/6835 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y02P80/30 ,  H01L2924/00

摘要： The assembly (100) comprises a laterally limited semiconductor substrate region (15) in which an electrical element (20) is defined. Thereon, an interconnect structure (21) is present. This is provided, at its first side (101) with contact pads (25,26) for coupling to an electric device (30), and at its second side (102) with connections (20) to the electrical element (11). Terminals (52,53) are present at the second side (102) of the interconnect structure (21), and coupled to the interconnect structure (21) through extensions (22,23) that are laterally displaced and isolated from the semiconductor substrate region (15). An electric device (30) is assembled to the first side (101) of the interconnect structure (21), and an encapsulation (40) extending on the first side (101) of the interconnect structure (21) so as to support it and encapsulating the electric device (30) is present.

摘要翻译： 组件（100）包括横向受限的半导体衬底区域（15），其中限定了电气元件（20）。 其中存在互连结构（21）。 在其第一侧（101）处设置有用于联接到电气设备（30）的接触焊盘（25,26），并且在其第二侧（102）处提供与电气元件（11）的连接（20）。 端子（52,53）存在于互连结构（21）的第二侧（102）处，并通过横向移位并与半导体衬底区域隔离的延伸部（22,23）耦合到互连结构（21） （15）。 电气装置（30）组装到互连结构（21）的第一侧（101），以及在互连结构（21）的第一侧（101）上延伸以便支撑它的封装（40） 存在电气装置（30）的封装。

公开(公告)号：US20100042010A1

公开(公告)日：2010-02-18

申请号：US12519817

申请日：2007-12-19

申请人： Ronald Dekker ,  Antoon Marie Henrie Tombeur ,  Theodorus Martinus Michielsen

发明人： Ronald Dekker ,  Antoon Marie Henrie Tombeur ,  Theodorus Martinus Michielsen

IPC分类号： A61B5/0432 ,  H01S4/00

CPC分类号： A61B5/0031 ,  A61B5/0215 ,  A61B5/027 ,  A61B5/03 ,  A61B5/042 ,  A61B5/1459 ,  A61B5/1473 ,  A61B2560/0219

摘要： A local power-delivery/data-reception unit is installed within an insertion end of a sealed catheter. The local power-delivery/data-reception unit wirelessly powers a separately sealed sensor that is attached to the insertion end and configured for wirelessly sending a data signal to the local power-delivery/data-reception unit. The catheter may further feature a remote power-delivery/data-reception unit disposed within the handle and configured for wirelessly communicating with the local power-delivery/data-reception unit and a controller for controlling the sensor.

摘要翻译： 局部送电/数据接收单元安装在密封导管的插入端内。 本地供电/数据接收单元无线地对附接到插入端的单独密封的传感器供电，并被配置为将数据信号无线发送到本地电力传送/数据接收单元。 导管还可以具有设置在手柄内并被配置为与本地供电/数据接收单元无线通信的远程电力传送/数据接收单元和用于控制传感器的控制器。

公开(公告)号：US06775350B2

公开(公告)日：2004-08-10

申请号：US10242924

申请日：2002-09-13

申请人： Catharina Huberta Henrica Emons ,  Henricus Godefridus Rafael Maas ,  Theodorus Martinus Michielsen ,  Ronald Dekker ,  Antonius Johannes Janssen ,  Ingrid Annemarie Rink

发明人： Catharina Huberta Henrica Emons ,  Henricus Godefridus Rafael Maas ,  Theodorus Martinus Michielsen ,  Ronald Dekker ,  Antonius Johannes Janssen ,  Ingrid Annemarie Rink

IPC分类号： G01N2320

CPC分类号： G01N23/225 ,  G01N23/223 ,  G01N2223/076 ,  H01L22/12

摘要： A method of examining a wafer of crystalline semiconductor material by means of X-rays, in which method a surface of the wafer is scanned by means of an X-ray beam and secondary radiation generated by said X-ray beam is detected. Prior to the examination the surface of the wafer which is to be scanned by the X-ray beam during the examination is glued to a substrate, after which crystalline semiconductor material is removed at the side which is then exposed, removal taking place as far as the top layer which adjoins the surface. The top layer can thus be examined without the examination being affected by crystal defects or impurities present in layers of the wafer which are situated underneath the top layer.

摘要翻译： 通过X射线检查晶体半导体材料的晶片的方法，其中通过X射线束扫描晶片的表面，并且检测由所述X射线束产生的二次辐射。 在检查之前，将在检查期间由X射线束扫描的晶片的表面胶合到基底上，然后在暴露的一侧去除结晶半导体材料，然后将其移除至 邻接表面的顶层。 因此可以检查顶层，而不检查晶体缺陷或存在于位于顶层下方的晶片层中的杂质。

公开(公告)号：US08708922B2

公开(公告)日：2014-04-29

申请号：US12519817

申请日：2007-12-19

申请人： Ronald Dekker ,  Antoon Marie Henrie Tombeur ,  Theodorus Martinus Michielsen

发明人： Ronald Dekker ,  Antoon Marie Henrie Tombeur ,  Theodorus Martinus Michielsen

IPC分类号： A61B5/04

CPC分类号： A61B5/0031 ,  A61B5/0215 ,  A61B5/027 ,  A61B5/03 ,  A61B5/042 ,  A61B5/1459 ,  A61B5/1473 ,  A61B2560/0219

摘要： A local power-delivery/data-reception unit is installed within an insertion end of a sealed catheter. The local power-delivery/data-reception unit wirelessly powers a separately sealed sensor that is attached to the insertion end and configured for wirelessly sending a data signal to the local power-delivery/data-reception unit. The catheter may further feature a remote power-delivery/data-reception unit disposed within the handle and configured for wirelessly communicating with the local power-delivery/data-reception unit and a controller for controlling the sensor.

摘要翻译： 局部送电/数据接收单元安装在密封导管的插入端内。 本地供电/数据接收单元无线地对附接到插入端的单独密封的传感器供电，并被配置为将数据信号无线发送到本地电力传送/数据接收单元。 导管还可以具有设置在手柄内并被配置为与本地供电/数据接收单元无线通信的远程电力传送/数据接收单元和用于控制传感器的控制器。

公开(公告)号：US20120038032A1

公开(公告)日：2012-02-16

申请号：US13279941

申请日：2011-10-24

申请人： Ronald Dekker ,  Theodorus Martinus Michielsen

发明人： Ronald Dekker ,  Theodorus Martinus Michielsen

IPC分类号： H01L29/06 ,  H01L21/56

CPC分类号： H01L27/12 ,  G02F1/133305 ,  G02F1/136227 ,  G02F1/167 ,  G02F2001/13613 ,  G02F2202/105 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/3244 ,  H01L51/524 ,  H01L51/5253 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2251/5338

摘要： The rollable device of the invention comprises a substrate of an insulating material with apertures extending from a first to a second side. On the first side switching elements are present, as well as interconnect lines and the like, covered by a coating of organic material. On the second side a functional layer is present. Examples of such functional layers include capacitors, antennas and particularly electro-optical layers. Thus, with a rollable display that may include an antenna and a driver circuit is obtained.

摘要翻译： 本发明的可滚动装置包括具有从第一侧延伸到第二侧的孔的绝缘材料的基底。 在第一侧上存在开关元件以及由有机材料涂层覆盖的互连线等。 在第二面上存在功能层。 这些功能层的实例包括电容器，天线，特别是电光层。 因此，可以获得可包括天线和驱动电路的可滚动显示器。

公开(公告)号：US07816774B2

公开(公告)日：2010-10-19

申请号：US10563416

申请日：2004-07-01

申请人： Ronald Dekker ,  Theodorus Martinus Michielsen ,  Antoon Marie Henrie Tombeur ,  Pieter Werner Hooijmans

发明人： Ronald Dekker ,  Theodorus Martinus Michielsen ,  Antoon Marie Henrie Tombeur ,  Pieter Werner Hooijmans

IPC分类号： H01L23/02

CPC分类号： H01L21/6835 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/4985 ,  H01L23/49855 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01Q1/38 ,  H01Q23/00 ,  Y10T29/49124 ,  H01L2924/00

摘要： A flexible device has an integrated circuit and an antenna incorporated or directly coupled to an interconnect structure of the integrated circuit. The interconnect structure extends outside of the active area. An electrically insulating or dielectric layer is present as support layer for both antenna and integrated circuit. The substrate is removed outside the active areas of the integrated circuit.

摘要翻译： 柔性器件具有集成电路和天线，其集成或直接耦合到集成电路的互连结构。 互连结构延伸到有效区域的外部。 存在电绝缘或介电层作为天线和集成电路的支撑层。 衬底被去除在集成电路的有源区域之外。

公开(公告)号：US20090127702A1

公开(公告)日：2009-05-21

申请号：US12282653

申请日：2006-06-22

申请人： Ronald Dekker ,  Theodorus Martinus Michielsen ,  Eduard Johannes Meijer

发明人： Ronald Dekker ,  Theodorus Martinus Michielsen ,  Eduard Johannes Meijer

IPC分类号： H01L23/36 ,  H01L21/768

CPC分类号： H01L23/3677 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/6835 ,  H01L23/36 ,  H01L23/3735 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2224/05599

摘要： The package (100) of the invention comprises at least one semiconductor device (30) provided with bond pads (32); an encapsulation (40), an interconnect element (20) and a heatsink (90). This element comprises a system of electrical interconnects (12) and is at least substantially covered by a thermally conductive, electrically insulating layer (11) at a first side (1) and that is provided with an electric isolation (13) at a second side (2), such that the isolation (13) and the thermally conducting layer (11) electrically isolate the electrical interconnects (12) from each other. At least one component of the encapsulation (40) and the heatsink (90) has an interface with the interconnect element (20), which interlace extends over substantially the complete side (1,2) to which the said component (40,90) is attached.

摘要翻译： 本发明的封装（100）包括设置有接合焊盘（32）的至少一个半导体器件（30）。 封装（40），互连元件（20）和散热片（90）。 该元件包括电互连系统（12），并且在第一侧（1）处至少基本被导热电绝缘层（11）覆盖，并且在第二侧设置有电隔离（13） （2），使得隔离层（13）和导热层（11）将电互连件（12）彼此电隔离。 封装（40）和散热器（90）的至少一个部件具有与互连元件（20）的界面，所述互连元件（20）的基本上完整的侧面（1,2）延伸，所述部件（40,90） 被附上。