发明申请
- 专利标题: Semiconductor module
- 专利标题(中): 半导体模块
-
申请号: US12292196申请日: 2008-11-13
-
公开(公告)号: US20090127717A1公开(公告)日: 2009-05-21
- 发明人: Sun-Won Kang , Young-Hee Song , Tae-Gyeong Chung , Nam-Seog Kim , Seung-Duk Baek
- 申请人: Sun-Won Kang , Young-Hee Song , Tae-Gyeong Chung , Nam-Seog Kim , Seung-Duk Baek
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 优先权: KR10-2007-0116811 20071115
- 主分类号: H01L23/49
- IPC分类号: H01L23/49
摘要:
A semiconductor module may include a circuit substrate with a first die on the circuit substrate and a second die on the first die. The first die may include at least one first data input/output pad on a first peripheral portion of the first die and at least one first control/address pad on a third peripheral portion, the third peripheral portion being separate from the first peripheral portion of the first die. The second die may include at least one second data input/output pad on a second peripheral portion and at least one second control/address pad on a fourth peripheral portion. The second peripheral portion of the second die is not overlapped with the first peripheral portion of the first die in plan view. The fourth peripheral portion of the second die overlaps at least a portion of the third peripheral portion of the first die.
公开/授权文献
- US08115324B2 Semiconductor module 公开/授权日:2012-02-14