A printed circuit board is disclosed. The printed circuit board, which may include an insulation layer, a first metal pad formed on the insulation layer, a second metal pad electrically coupled with the first metal pad and having an ionization tendency lower than that of the first metal pad, and a sacrificial electrode electrically coupled with the second metal pad to prevent corrosion in the first metal pad, can be utilized to prevent excessive etching that may otherwise occur due to galvanic corrosion between metal pads of different ionization tendencies.