公开(公告)号：US20110286191A1

公开(公告)日：2011-11-24

申请号：US12926337

申请日：2010-11-10

申请人： Byoung Chan Kim ,  Young Hwan Shin ,  Chin Kwan Kim ,  Dong Won Kim ,  Kui Won Kang

发明人： Byoung Chan Kim ,  Young Hwan Shin ,  Chin Kwan Kim ,  Dong Won Kim ,  Kui Won Kang

IPC分类号： H05K7/06

CPC分类号： H01L23/49816 ,  H01L21/563 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/00012 ,  H01L2924/00

摘要： Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill.

摘要翻译： 这里公开了一种印刷电路板。 印刷电路板包括：基底基板，其包括安装有半导体芯片的第一区域和位于第一区域外部的第二区域;覆盖基底基板并且包括形成在第二区域上的沟槽的第一绝缘图案，以及第二绝缘图案突出 从第二区域上的第一绝缘图案。 在形成底部填充剂的过程中，沟槽和第二绝缘图案可以用作限定形成预处理形状的底部填充材料的结构。

公开(公告)号：US20090133902A1

公开(公告)日：2009-05-28

申请号：US12292853

申请日：2008-11-26

申请人： Chin-Kwan Kim ,  Tae-Gon Lee ,  Young-Mi Lee ,  Yoon-Hee Kim ,  Hwa-Jun Jung ,  Kui-Won Kang ,  Yong-Bin Lee

发明人： Chin-Kwan Kim ,  Tae-Gon Lee ,  Young-Mi Lee ,  Yoon-Hee Kim ,  Hwa-Jun Jung ,  Kui-Won Kang ,  Yong-Bin Lee

IPC分类号： H05K1/00

CPC分类号： H05K1/111 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/244 ,  H05K3/282 ,  H05K2201/0391 ,  H05K2201/09781 ,  Y02P70/611

摘要： A printed circuit board is disclosed. The printed circuit board, which may include an insulation layer, a first metal pad formed on the insulation layer, a second metal pad electrically coupled with the first metal pad and having an ionization tendency lower than that of the first metal pad, and a sacrificial electrode electrically coupled with the second metal pad to prevent corrosion in the first metal pad, can be utilized to prevent excessive etching that may otherwise occur due to galvanic corrosion between metal pads of different ionization tendencies.

摘要翻译： 公开了印刷电路板。 印刷电路板可以包括绝缘层，形成在绝缘层上的第一金属焊盘，与第一金属焊盘电耦合并具有比第一金属焊盘低的电离趋势的第二金属焊盘，以及牺牲 与第二金属焊盘电耦合以防止第一金属焊盘中的腐蚀的电极可用于防止由于不同电离趋势的金属焊盘之间的电偶腐蚀而可能发生的过度蚀刻。

公开(公告)号：US08253034B2

公开(公告)日：2012-08-28

申请号：US12926337

申请日：2010-11-10

申请人： Byoung Chan Kim ,  Young Hwan Shin ,  Chin Kwan Kim ,  Dong Won Kim ,  Kui Won Kang

发明人： Byoung Chan Kim ,  Young Hwan Shin ,  Chin Kwan Kim ,  Dong Won Kim ,  Kui Won Kang

IPC分类号： H05K1/11 ,  H05K1/18 ,  H05K7/10

CPC分类号： H01L23/49816 ,  H01L21/563 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/00012 ,  H01L2924/00

摘要： Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill.

摘要翻译： 这里公开了一种印刷电路板。 印刷电路板包括：基底基板，其包括安装有半导体芯片的第一区域和位于第一区域外部的第二区域;覆盖基底基板并且包括形成在第二区域上的沟槽的第一绝缘图案，以及第二绝缘图案突出 从第二区域上的第一绝缘图案。 在形成底部填充剂的过程中，沟槽和第二绝缘图案可以用作限定形成预处理形状的底部填充材料的结构。