发明申请
- 专利标题: HEAT-CURABLE RESIN COMPOSITION INCLUDING SILICONE POWDER
- 专利标题(中): 可固化树脂组合物,包括硅酮粉
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申请号: US12089503申请日: 2006-10-04
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公开(公告)号: US20090133905A1公开(公告)日: 2009-05-28
- 发明人: Kazuya Kimura , Hiroshi Uchida
- 申请人: Kazuya Kimura , Hiroshi Uchida
- 申请人地址: JP Minato-ku
- 专利权人: Showa Denko K.K.
- 当前专利权人: Showa Denko K.K.
- 当前专利权人地址: JP Minato-ku
- 优先权: JP2005-295276 20051007
- 国际申请: PCT/JP2006/320233 WO 20061004
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; C08L75/04 ; H05K1/00
摘要:
A heat-curable resin composition has excellent printability, non-tackiness, matte and electrical properties. The heat-curable resin composition includes a heat-curable resin (A) and silicone powder (B). Preferably, the silicone powder (B) is spherical or substantially spherical, and has a specific gravity of 0.95 to 1.5 and a particle diameter of 0.01 to 10 μm. The heat-curable resin (A) preferably includes a carboxyl group-containing polyurethane and a heat-curable component. The carboxyl group-containing polyurethane is obtained by reacting a polyisocyanate compound (a), a polyol compound (b) (other than compound (c)), and a carboxyl group-containing dihydroxy compound (c).