公开(公告)号：US08524838B2

公开(公告)日：2013-09-03

申请号：US11663192

申请日：2005-09-20

申请人： Kazuya Kimura ,  Hiroshi Uchida

发明人： Kazuya Kimura ,  Hiroshi Uchida

IPC分类号： C08L69/00 ,  C08L75/06 ,  C08F283/02

CPC分类号： H05K3/285 ,  C08G18/12 ,  C08G18/44 ,  C08G18/672 ,  C09D175/06 ,  C09D175/16 ,  H05K2203/124 ,  C08G18/281 ,  C08G18/6659 ,  C08G18/0823

摘要： The invention provides a heat-curable resin composition comprising (A) a polyurethane having two or more carboxyl groups in one molecule, in particular a polyurethane having one or more carboxyl groups at a molecular terminal and (B) a heat-curable component, a cured product thereof, a solder resist and a protective film consisting of the cured product and a printed wiring board coated with the cured product. The polyurethane (A), preferably has a number average molecular weight of 500 to 100,000 and an acid value of 5 to 150 mgKOH/g. The heat-curable component (B) is preferably an epoxy resin. The heat-curable resin composition of the invention is excellent in adhesion with a substrate, low-warpage property, flexibility, resistance to moisture and heat, soldering heat resistance and resistance to tin plating.

摘要翻译： 本发明提供一种热固性树脂组合物，其包含（A）在一个分子中具有两个或更多个羧基的聚氨酯，特别是在分子末端具有一个或多个羧基的聚氨酯和（B）可热固化组分， 其固化产物，阻焊剂和由固化产物组成的保护膜和涂覆有固化产物的印刷线路板。 聚氨酯（A）的数均分子量优选为500〜100,000，酸值为5〜150mgKOH / g。 可热固化成分（B）优选为环氧树脂。 本发明的热固性树脂组合物与基材的粘合性优异，翘曲性，柔软性，耐湿热性，耐焊接性，耐镀锡性优异。

公开(公告)号：US20090082518A1

公开(公告)日：2009-03-26

申请号：US11914435

申请日：2006-05-16

申请人： Hiroshi Uchida ,  Ritsuko Hirakawa ,  Yoshio Miyajima ,  Hirofumi Inoue ,  Kazuya Kimura ,  Yukihiko Azuma

发明人： Hiroshi Uchida ,  Ritsuko Hirakawa ,  Yoshio Miyajima ,  Hirofumi Inoue ,  Kazuya Kimura ,  Yukihiko Azuma

IPC分类号： C08L75/04 ,  C08G18/32 ,  C08L67/00 ,  C09D11/10 ,  C09D175/04

CPC分类号： H05K3/285 ,  C08G18/0823 ,  C08G18/348 ,  C08G18/44 ,  C08G18/6576 ,  C08G18/6659 ,  C08G18/69 ,  C08G18/698 ,  C09D11/106 ,  C09D175/04 ,  H05K1/0393

摘要： Disclosed is a carboxyl group-containing polyurethane (A) produced from a polyol (b) containing at least 10 mol % (relative to the total (100 mol %) of the polyol (b)) of a polyol (b1) which: (i) has a number-average molecular weight of 500 to 50,000; (ii) has 1 to 10 hydroxyl groups per molecule; and (iii) is one or a combination of two or more polyols selected from the group consisting of polybutadiene polyol, polyisoprene polyol, hydrogenated polybutadiene polyol and hydrogenated polyisoprene polyol. The carboxyl group-containing polyurethane (A) is suitable as materials of cured products, for example cured films, that are excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability.

摘要翻译： 公开了由多元醇（b）生成的含有羧基的聚氨酯（A），该多元醇（b）含有多元醇（b1）的至少10摩尔％（相对于多元醇（b）的总量（100摩尔％））为：（ i）数均分子量为500〜50,000; （ii）每分子具有1至10个羟基; 和（iii）是选自聚丁二烯多元醇，聚异戊二烯多元醇，氢化聚丁二烯多元醇和氢化聚异戊二烯多元醇的一种或两种以上的多元醇的组合。 含羧基的聚氨酯（A）适合作为与基材的粘合性优异，翘曲翘曲，柔韧性，耐电镀性，焊接耐热性，长期可靠性等固化物例如固化膜的材料。

公开(公告)号：US20080227946A1

公开(公告)日：2008-09-18

申请号：US11547664

申请日：2005-04-05

申请人： Hirotoshi Kamata ,  Kazuya Kimura ,  Hiroshi Uchida

发明人： Hirotoshi Kamata ,  Kazuya Kimura ,  Hiroshi Uchida

IPC分类号： C08G63/02

CPC分类号： C08K5/3445 ,  C08L67/025 ,  C08L101/08 ,  C08L2666/02 ,  C09J167/025 ,  H05K3/287 ,  H05K3/4676 ,  C08L67/00

摘要： The invention relates to a thermosetting composition comprising (A) a compound having at least one oxetanyl group in the molecule, (B) a compound having at least two carboxyl groups in the molecule, and (C) an imidazolium salt, curing method thereof and products cured thereby. Cured products prepared from the composition of the invention is excellent in electrical isolation, flexibility, adhesiveness and mechanical strength.

摘要翻译： 本发明涉及一种热固性组合物，其包含（A）在分子中具有至少一个氧杂环丁烷基的化合物，（B）分子中具有至少两个羧基的化合物和（C）咪唑鎓盐，其固化方法和 产品被固化。 由本发明组合物制备的固化产品在电绝缘性，柔韧性，粘合性和机械强度方面优异。

公开(公告)号：US20080188625A1

公开(公告)日：2008-08-07

申请号：US11885258

申请日：2006-03-03

申请人： Hiroshi Uchida ,  Kazuya Kimura ,  Yuko Sakata

发明人： Hiroshi Uchida ,  Kazuya Kimura ,  Yuko Sakata

IPC分类号： C08L75/04

CPC分类号： C08G18/44 ,  C08G18/0823 ,  C08G18/3212 ,  C08G18/672 ,  C08G18/73 ,  C08G18/757 ,  C08G18/758 ,  C08G18/7621 ,  C08G18/7642 ,  C08G59/4269 ,  C08L63/00 ,  C08L75/16 ,  C08G18/6659 ,  C08L2666/22

摘要： The invention relates to a carboxyl group-containing polyurethane, which is obtained by reacting (a) a polyisocyanate compound, (b) a polycarbonate diol having a molecular weight of 300 to 50,000, (c) a dihydroxy compound having a carboxyl group and when necessary (d) a monohydroxy compound, a thermosetting composition using the carboxyl group-containing polyurethane and a paste for forming a film using thermosetting composition. The thermosetting composition of the invention is excellent in adhesion to a substrate, low warpage, flexibility, plating resistance and soldering heat resistance.

摘要翻译： 本发明涉及含羧基的聚氨酯，其通过使（a）多异氰酸酯化合物，（b）分子量为300〜50,000的聚碳酸酯二醇，（c）具有羧基的二羟基化合物和 必要的（d）单羟基化合物，使用含羧基的聚氨酯的热固性组合物和使用热固性组合物形成膜的糊剂。 本发明的热固性组合物对基材的粘附性优异，翘曲性，柔韧性，耐电镀性和耐焊接性优异。

公开(公告)号：US20090133905A1

公开(公告)日：2009-05-28

申请号：US12089503

申请日：2006-10-04

申请人： Kazuya Kimura ,  Hiroshi Uchida

发明人： Kazuya Kimura ,  Hiroshi Uchida

IPC分类号： H05K1/11 ,  C08L75/04 ,  H05K1/00

CPC分类号： H05K3/285 ,  C08G18/0823 ,  C08G18/0852 ,  C08G18/12 ,  C08G18/348 ,  C08G18/44 ,  C08G18/6659 ,  C08G18/758 ,  C08L75/04 ,  H05K2201/0162 ,  H05K2201/0212 ,  C08G18/282 ,  C08L2666/14

摘要： A heat-curable resin composition has excellent printability, non-tackiness, matte and electrical properties. The heat-curable resin composition includes a heat-curable resin (A) and silicone powder (B). Preferably, the silicone powder (B) is spherical or substantially spherical, and has a specific gravity of 0.95 to 1.5 and a particle diameter of 0.01 to 10 μm. The heat-curable resin (A) preferably includes a carboxyl group-containing polyurethane and a heat-curable component. The carboxyl group-containing polyurethane is obtained by reacting a polyisocyanate compound (a), a polyol compound (b) (other than compound (c)), and a carboxyl group-containing dihydroxy compound (c).

摘要翻译： 热固性树脂组合物具有优异的印刷性，非粘性，无光泽和电性能。 热固性树脂组合物包含热固性树脂（A）和硅氧烷粉末（B）。 优选地，硅氧烷粉末（B）是球形或基本上球形的，比重为0.95至1.5，粒径为0.01至10微米。 热固性树脂（A）优选包含含羧基的聚氨酯和可热固化组分。 含羧基的聚氨酯通过使多异氰酸酯化合物（a），多元醇化合物（b）（化合物（c）以外）与含羧基的二羟基化合物（c）反应而得到。

公开(公告)号：US20070293636A1

公开(公告)日：2007-12-20

申请号：US11663192

申请日：2005-09-20

申请人： Kazuya Kimura ,  Hiroshi Uchida

发明人： Kazuya Kimura ,  Hiroshi Uchida

IPC分类号： C08F283/04 ,  C08G18/00

CPC分类号： H05K3/285 ,  C08G18/12 ,  C08G18/44 ,  C08G18/672 ,  C09D175/06 ,  C09D175/16 ,  H05K2203/124 ,  C08G18/281 ,  C08G18/6659 ,  C08G18/0823

摘要： The invention provides a heat-curable resin composition comprising (A) a polyurethane having two or more carboxyl groups in one molecule, in particular a polyurethane having one or more carboxyl groups at a molecular terminal and (B) a heat-curable component, a cured product thereof, a solder resist and a protective film consisting of the cured product and a printed wiring board coated with the cured product. The polyurethane(A), preferably has a number average molecular weight of 500 to 100,000 and an acid value of 5 to 150 mgKOH/g. The heat-curable component (B) is preferably an epoxy resin. The heat-curable resin composition of the invention is excellent in adhesion with a substrate, low-warpage property, flexibility, resistance to moisture and heat, soldering heat resistance and resistance to tin plating.

摘要翻译： 本发明提供一种热固性树脂组合物，其包含（A）在一个分子中具有两个或更多个羧基的聚氨酯，特别是在分子末端具有一个或多个羧基的聚氨酯和（B）可热固化组分， 其固化产物，阻焊剂和由固化产物组成的保护膜和涂覆有固化产物的印刷线路板。 聚氨酯（A）的数均分子量优选为500〜100,000，酸值为5〜150mgKOH / g。 可热固化成分（B）优选为环氧树脂。 本发明的热固性树脂组合物与基材的粘合性优异，翘曲性，柔软性，耐湿热性，耐焊接性，耐镀锡性优异。

公开(公告)号：US09535169B2

公开(公告)日：2017-01-03

申请号：US13977840

申请日：2011-11-25

申请人： Hiroshi Uchida

发明人： Hiroshi Uchida

IPC分类号： G01T1/20 ,  G01T1/164 ,  G01T1/29

CPC分类号： G01T1/2006 ,  G01T1/1644 ,  G01T1/2985

摘要： Provided is a radiation detector that prevents a decline in detection efficiency as well as having excellent temporal characteristics. The radiation detector 1, which detects a radiation, includes a scintillator array 10 having a plurality of scintillator cells 11, a photodetector array 20 having a plurality of photodetectors 21, and a photodetector array 30 having a plurality of photodetectors 31. The plurality of photodetectors 21 and the plurality of photodetectors 31 are solid-state photodetectors that can transmit a gamma ray G1, G2. The scintillator cell 11 is separated into a plurality of light emitting regions 11a, 11b by a reflecting region 12, and the reflecting region 12 extends between the incident surface 10a side and the back surface 10b side along a surface SP that is inclined with respect to the incident surface 10a and the back surface 10b.

摘要翻译： 提供了防止检测效率下降以及具有优异的时间特性的辐射检测器。 检测辐射的辐射检测器1包括具有多个闪烁体单元11的闪烁体阵列10，具有多个光电检测器21的光电检测器阵列20和具有多个光电检测器31的光电检测器阵列30.多个光电检测器 21，多个光检测器31是能够透射伽马射线G1，G2的固体光电检测器。 闪烁体单元11通过反射区域12分离成多个发光区域11a，11b，反射区域12沿着相对于第二区域的倾斜的表面SP在入射面10a侧和背面10b侧之间延伸 入射面10a和背面10b。

公开(公告)号：US09085728B2

公开(公告)日：2015-07-21

申请号：US13982182

申请日：2012-01-16

申请人： Hiroshi Uchida ,  Takaki Yasuda ,  Toshio Fujita

发明人： Hiroshi Uchida ,  Takaki Yasuda ,  Toshio Fujita

IPC分类号： H01L33/00 ,  C09K11/02 ,  H01L23/00 ,  H01L33/44 ,  H01L33/50 ,  C09K11/56 ,  H01L23/057

CPC分类号： C09K11/025 ,  C09K11/565 ,  H01L23/057 ,  H01L23/564 ,  H01L33/44 ,  H01L33/501 ,  H01L33/502 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0041 ,  Y10T428/3192 ,  H01L2924/00014

摘要： Provided are a composition containing a quantum dot fluorescent body, a molded body of a quantum dot fluorescent body dispersion resin, a structure containing a quantum dot fluorescent body, a light-emitting device, an electronic apparatus or a mechanical device, and a method for producing the molded body. The quantum dot fluorescent body is dispersed in a cycloolefin (co)polymer, which is a dispersion resin, to form the composition containing a quantum dot fluorescent body. The composition containing the quantum dot fluorescent body is molded, forming the molded body of the quantum dot fluorescent body dispersion resin. A gas barrier layer is formed at a portion or the entirety of the surface of the molded body of the quantum dot fluorescent body dispersion resin. A light-emitting device is configured using the composition containing the quantum dot fluorescent body as a sealing material that seals an LED chip.

摘要翻译： 提供了含有量子点荧光体，量子点荧光体分散树脂的成型体，含有量子点荧光体的结构，发光装置，电子设备或机械装置的组合物，以及用于 生产成型体。 量子点荧光体分散在作为分散树脂的环烯烃（共）聚合物中，形成含有量子点荧光体的组合物。 将含有量子点荧光体的组合物成型，形成量子点荧光体分散树脂的成型体。 在量子点荧光体分散树脂的成型体的表面的一部分或全部形成阻气层。 使用包含量子点荧光体的组合物作为密封LED芯片的密封材料来构造发光器件。

公开(公告)号：US08993791B2

公开(公告)日：2015-03-31

申请号：US13515707

申请日：2010-12-17

申请人： Hiroshi Uchida ,  Takamitsu Kobayashi ,  Naoya Fukumoto

发明人： Hiroshi Uchida ,  Takamitsu Kobayashi ,  Naoya Fukumoto

IPC分类号： C07D301/03 ,  C07D301/12 ,  C07D303/28

CPC分类号： C07D301/12 ,  C07D303/28

摘要： To provide an efficient method of producing an epoxy compound comprising reacting hydrogen peroxide and acetonitrile with the carbon-carbon double bond of an organic compound having a carbon-carbon double bond. A method of producing an epoxy compound comprising epoxidizing the carbon-carbon double bond of an organic compound having a carbon-carbon double bond in the presence of acetonitrile by using hydrogen peroxide as an oxidizing agent, wherein the reaction proceeds while controlling the acetonitrile concentration in the reaction system in the range of 0.6-5 mol/L by using a solvent containing an alcohol.

摘要翻译： 提供一种制备环氧化合物的有效方法，包括使过氧化氢和乙腈与具有碳 - 碳双键的有机化合物的碳 - 碳双键反应。 一种环氧化合物的制造方法，其特征在于，在乙腈存在下，通过使用过氧化氢作为氧化剂，使具有碳 - 碳双键的有机化合物的碳 - 碳双键环氧化，其中反应进行同时控制乙腈浓度 通过使用含有醇的溶剂，反应体系在0.6-5mol / L的范围内。

公开(公告)号：US08980117B2

公开(公告)日：2015-03-17

申请号：US13142602

申请日：2010-01-01

申请人： Makoto Kubota ,  Toshihiro Ifuku ,  Hiroshi Funakubo ,  Keisuke Yazawa ,  Hiroshi Uchida ,  Takashi Iijima ,  Bong-yeon Lee

发明人： Makoto Kubota ,  Toshihiro Ifuku ,  Hiroshi Funakubo ,  Keisuke Yazawa ,  Hiroshi Uchida ,  Takashi Iijima ,  Bong-yeon Lee

IPC分类号： H01L41/18 ,  C04B35/111 ,  C04B35/01 ,  H01L41/187 ,  H01L41/316

CPC分类号： C04B35/111 ,  C04B35/01 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/3232 ,  C04B2235/3262 ,  C04B2235/327 ,  C04B2235/3284 ,  C04B2235/3298 ,  H01L41/1878 ,  H01L41/316 ,  Y10S428/938 ,  Y10T428/265

摘要： Provided is a piezoelectric material having a high Curie temperature and satisfactory piezoelectric characteristics, the piezoelectric material being represented by the following general formula (1): A(ZnxTi(1-x))yM(1-y)O3  (1) where A represents a Bi element, M represents at least one element selected from Fe, Al, Sc, Mn, Y, Ga, and Yb; x represents a numerical value of 0.4≦x≦0.6; and y represents a numerical value of 0.17≦y≦0.60.

摘要翻译： 提供具有高居里温度和令人满意的压电特性的压电材料，压电材料由以下通式（1）表示：A（Zn x Ti（1-x））yM（1-y）O 3（1）其中A 表示Bi元素，M表示选自Fe，Al，Sc，Mn，Y，Ga和Yb中的至少一种元素; x表示数值0.4＆nlE; x＆nlE; 0.6; y表示数值为0.17＆nlE; y＆nlE; 0.60。