To provide a release film which is used to avoid adherence between a press hot plate and a printed circuit board or a cover lay film at the time of press work effected to printed circuit boards such as printed wiring boards, flexible printed circuit boards and multilayered printed circuit boards and which has a heat resistance, a releasing property, a non-contamination property, a follow up capability relative to the circuit pattern, an excellent workability during processing and a small environmental impact at the time of disposal, the release film has a shear modulus of 5×105˜107 Pa at a hot press lamination temperature and is formed by overlapping at least one thermoplastic resin layer and at least one metallic layer one above the other.