发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CARRIER AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 具有载体的集成电路包装系统及其制造方法
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申请号： US12360644申请日： 2009-01-27
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公开(公告)号： US20090134509A1公开(公告)日： 2009-05-28
- 发明人: Choong Bin Yim , Hyeog Chan Kwon , Jong-Woo Ha
- 申请人： Choong Bin Yim , Hyeog Chan Kwon , Jong-Woo Ha
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L21/71 ; H01L23/522
摘要：
A method of manufacture of an integrated circuit packaging system includes: forming a carrier having a top side and a bottom side; forming an edge terminal pad on the top side and an inner terminal pad on the bottom side; connecting an integrated circuit die to an inner portion of the edge terminal pad; and encapsulating the integrated circuit die and the inner portion of the edge terminal pad with the outer portion of the edge terminal pad exposed.
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