发明申请
- 专利标题: MULTILAYER ELECTRONIC COMPONENT AND MULTILAYER ARRAY ELECTRONIC COMPONENT
- 专利标题(中): 多层电子元件和多层阵列电子元件
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申请号: US12351132申请日: 2009-01-09
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公开(公告)号: US20090134956A1公开(公告)日: 2009-05-28
- 发明人: Kenjiro Hadano , Tomohiro Sasaki , Yoshihisa Kimura , Takafumi Kusuyama
- 申请人: Kenjiro Hadano , Tomohiro Sasaki , Yoshihisa Kimura , Takafumi Kusuyama
- 申请人地址: JP Nagaokakyo-shi
- 专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址: JP Nagaokakyo-shi
- 优先权: JP2006-190993 20060711
- 主分类号: H03H7/00
- IPC分类号: H03H7/00
摘要:
A multilayer array electronic component includes a multilayer composite including a helical coil and a capacitor that are defined by stacking a coil conductor, a capacitor conductor, and a ceramic sheet on one another. External electrodes are arranged on the surface of the multilayer composite and electrically connected to the helical coil or the capacitor. A direction identification mark is arranged on the upper surface of the multilayer composite and electrically connected to any of the external electrodes through the helical coil or the capacitor.
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