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1.发明授权公开(公告)号：US07663453B2
公开(公告)日：2010-02-16
申请号：US12351132
申请日：2009-01-09
IPC分类号： H01G2/24
CPC分类号： H01F17/0013 , H01G2/24 , H01G4/232 , H01G4/30 , H01G4/40
摘要： A multilayer array electronic component includes a multilayer composite including a helical coil and a capacitor that are defined by stacking a coil conductor, a capacitor conductor, and a ceramic sheet on one another. External electrodes are arranged on the surface of the multilayer composite and electrically connected to the helical coil or the capacitor. A direction identification mark is arranged on the upper surface of the multilayer composite and electrically connected to any of the external electrodes through the helical coil or the capacitor.
摘要翻译： 多层阵列电子部件包括通过层叠线圈导体，电容器导体和陶瓷片而彼此定义的包括螺旋线圈和电容器的多层复合体。 外部电极布置在多层复合材料的表面上并与螺旋线圈或电容器电连接。 方向识别标记布置在多层复合材料的上表面上，并通过螺旋线圈或电容器电连接到任何外部电极。
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2.发明申请公开(公告)号：US20090134956A1
公开(公告)日：2009-05-28
申请号：US12351132
申请日：2009-01-09
IPC分类号： H03H7/00
CPC分类号： H01F17/0013 , H01G2/24 , H01G4/232 , H01G4/30 , H01G4/40
摘要： A multilayer array electronic component includes a multilayer composite including a helical coil and a capacitor that are defined by stacking a coil conductor, a capacitor conductor, and a ceramic sheet on one another. External electrodes are arranged on the surface of the multilayer composite and electrically connected to the helical coil or the capacitor. A direction identification mark is arranged on the upper surface of the multilayer composite and electrically connected to any of the external electrodes through the helical coil or the capacitor.
摘要翻译： 多层阵列电子部件包括通过层叠线圈导体，电容器导体和陶瓷片而彼此定义的包括螺旋线圈和电容器的多层复合体。 外部电极布置在多层复合材料的表面上并与螺旋线圈或电容器电连接。 方向识别标记布置在多层复合材料的上表面上，并通过螺旋线圈或电容器电连接到任何外部电极。
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