发明申请
- 专利标题： Cap member and semiconductor device employing same
- 专利标题（中）： 盖构件和使用其的半导体器件
-
申请号： US12292672申请日： 2008-11-24
-
公开(公告)号： US20090140416A1公开(公告)日： 2009-06-04
- 发明人: Masaya Ishida , Daisuke Hanaoka , Takeshi Horiguchi
- 申请人： Masaya Ishida , Daisuke Hanaoka , Takeshi Horiguchi
- 专利权人： Sharp Kabushiki Kaisha
- 当前专利权人： Sharp Kabushiki Kaisha
- 优先权： JP2007-309425 20071129
- 主分类号： H01L23/04
- IPC分类号： H01L23/04 ; B65D85/00
摘要：
A cap member capable of alleviating degradation of reliability and improving fabrication yields is provided. The cap member has a cylindrical side wall portion, a top face portion closing one end of the side wall portion and having a light exit hole formed therein to allow extraction of laser light from a semiconductor laser chip; a light transmission window fitted to the top face portion to stop the light exit hole, and a flange portion arranged at the other end of the side wall portion and welded on the upper face of a stem on which the semiconductor laser chip is mounted. A groove portion is formed in an inner surface of the top face portion, and this groove portion makes part of the top face portion in a predetermined region less thick than the other part thereof.
公开/授权文献
- US08253240B2 Cap member and semiconductor device employing same 公开/授权日：2012-08-28