公开(公告)号：US08253240B2

公开(公告)日：2012-08-28

申请号：US12292672

申请日：2008-11-24

申请人： Masaya Ishida ,  Daisuke Hanaoka ,  Takeshi Horiguchi

发明人： Masaya Ishida ,  Daisuke Hanaoka ,  Takeshi Horiguchi

IPC分类号： H01L23/12

CPC分类号： H01S5/02212 ,  H01L2224/48091 ,  H01L2924/19107 ,  H01S5/02296 ,  H01L2924/00014

摘要： A cap member capable of alleviating degradation of reliability and improving fabrication yields is provided. The cap member has a cylindrical side wall portion, a top face portion closing one end of the side wall portion and having a light exit hole formed therein to allow extraction of laser light from a semiconductor laser chip; a light transmission window fitted to the top face portion to stop the light exit hole, and a flange portion arranged at the other end of the side wall portion and welded on the upper face of a stem on which the semiconductor laser chip is mounted. A groove portion is formed in an inner surface of the top face portion, and this groove portion makes part of the top face portion in a predetermined region less thick than the other part thereof.

摘要翻译： 提供了能够减轻可靠性降低并提高制造成品率的盖构件。 盖构件具有圆筒形侧壁部分，顶面部分，其封闭侧壁部分的一端并且具有形成在其中的光出射孔，以允许从半导体激光芯片提取激光; 安装在顶面部上以阻止光射出孔的光透射窗，以及布置在侧壁部分的另一端并焊接在其上安装半导体激光芯片的杆的上表面上的凸缘部分。 在顶面部的内表面形成有槽部，该槽部使顶面部的一部分成为比其他部分厚的规定区域。

公开(公告)号：US06972205B2

公开(公告)日：2005-12-06

申请号：US10655044

申请日：2003-09-05

申请人： Ikuo Kohashi ,  Osamu Hamaoka ,  Takeshi Horiguchi

发明人： Ikuo Kohashi ,  Osamu Hamaoka ,  Takeshi Horiguchi

IPC分类号： G11B7/125 ,  G11B7/135 ,  G11B7/22 ,  H01S5/02 ,  H01S5/022 ,  H01S5/30 ,  H01L21/00

CPC分类号： H01S5/0226 ,  H01S5/005 ,  H01S5/02236 ,  H01S5/02268 ,  H01S2301/02

摘要： In a semiconductor laser device, a semiconductor laser chip is placed on a stem so that an end surface of the semiconductor laser chip, on which the main radiation side light emission point is located, protrudes from an edge of a header portion of the stem or from an edge of a header portion of a sub-mount provided on the stem so as to conceal no light emission points of the semiconductor. A conductive die bonding paste is used for the die bonding of the semiconductor laser chip. A chamfered portion or a rounded corner portion is formed at the edge of the header portion of the stem or the edge of the header portion of the sub-mount provided on the stem. Also, an optical pickup is constructed of at least the semiconductor laser device, a diffraction grating, a photodetector, a condenser lens and an object lens.

摘要翻译： 在半导体激光器件中，将半导体激光器芯片放置在杆上，使得主辐射侧发光点所在的半导体激光器芯片的端面从杆的头部的边缘突出，或 从设置在杆上的副安装座的集管部分的边缘开始，以便不隐藏半导体的发光点。 导电芯片粘接膏用于半导体激光芯片的裸片接合。 在杆的集管部分的边缘或设置在杆上的副安装座的集管部分的边缘处形成倒角部分或圆角部分。 此外，光学拾取器至少由半导体激光器件，衍射光栅，光电检测器，聚光透镜和物镜构成。

公开(公告)号：US5617788A

公开(公告)日：1997-04-08

申请号：US635005

申请日：1996-04-19

申请人： Takeshi Horiguchi ,  Satoru Sasaki ,  Hideaki Miyake

发明人： Takeshi Horiguchi ,  Satoru Sasaki ,  Hideaki Miyake

IPC分类号： B41F13/00 ,  B41F7/12 ,  B41F33/00 ,  B41F33/04 ,  B41F33/08 ,  B41F5/06 ,  B41F13/12

CPC分类号： B41F7/12 ,  B41P2213/252 ,  B41P2217/13

摘要： A continuously operative printing machine and a method of operating the same are disclosed. The printing machine has a plurality of switchable printing units to be used selectively by switching. For continuous printing the printing units are switched alternately by coupling and decoupling first coupling/decoupling means while a continuous printing web is held running. Plate change of stationary printing units is done with independent drive means to be ready for the next printing. Then the stationary printing units are restored to the printing state through synchronous control by rotational control means. Thus plate change printing or the like can be carried out continuously without stopping the printing machine. In addition, high quality printing can be obtained efficiently. Further, it is possible to obtain double side printing.

摘要翻译： 公开了连续操作的印刷机及其操作方法。 印刷机具有通过切换选择性地使用的多个可切换打印单元。 为了连续打印，打印单元交替地通过耦合和去耦合第一耦合/去耦装置，同时连续打印幅片保持运行。 固定式印刷装置的印版更换采用独立的驱动装置进行下一次印刷。 然后通过旋转控制装置的同步控制将固定打印单元恢复到打印状态。 因此，可以在不停止印刷机的情况下连续进行印版变印等。 此外，可以有效地获得高质量的印刷。 此外，可以获得双面印刷。

公开(公告)号：US4789814A

公开(公告)日：1988-12-06

申请号：US70709

申请日：1987-07-07

申请人： Naotomo Akashi ,  Takeshi Yokokawa ,  Katsuaki Ninomiya ,  Harumi Shima ,  Takeshi Horiguchi

发明人： Naotomo Akashi ,  Takeshi Yokokawa ,  Katsuaki Ninomiya ,  Harumi Shima ,  Takeshi Horiguchi

IPC分类号： C03B25/08 ,  B65G43/10 ,  C03B35/16 ,  H02P5/46

CPC分类号： B65G43/10 ,  C03B35/164 ,  Y02P40/57

摘要： A transport speed control system for a glass ribbon annealing installation comprising means to control a peripheral drive speed of those of glass ribbon transporting rollers which contact a portion of the glass ribbon at positions downstream of at least a substantially mid-position of the glass ribbon with respect to a direction of transport, to be higher than an advancing speed of that portion of the glass ribbon.

摘要翻译： 一种用于玻璃带退火设备的运输速度控制系统，包括用于控制玻璃带传送辊的外围驱动速度的装置，所述辊的玻璃带传送辊的玻璃带的至少一个中间位置的玻璃带的一部分接触玻璃带的一部分， 相对于运送方向，要高于该玻璃带部分的前进速度。

公开(公告)号：US20120236230A1

公开(公告)日：2012-09-20

申请号：US13510721

申请日：2010-09-15

申请人： Hiroki Nakahama ,  Takashi Matsui ,  Takeshi Horiguchi ,  Motoji Shiota

发明人： Hiroki Nakahama ,  Takashi Matsui ,  Takeshi Horiguchi ,  Motoji Shiota

IPC分类号： G02F1/1335 ,  H01J9/00 ,  H05K13/04 ,  H05K1/18

CPC分类号： G02F1/1345 ,  G02F2001/13456 ,  H01L23/4985 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/02185 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/1146 ,  H01L2224/13006 ,  H01L2224/13019 ,  H01L2224/16 ,  H01L2224/16013 ,  H01L2224/16112 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/17107 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81395 ,  H01L2224/81424 ,  H01L2224/81481 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  Y10T156/10 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/05552

摘要： Disclosed is a device substrate wherein an insulating layer (60) having a terminal (24) formed on the surface thereof is formed over the entire surface of a glass substrate (20), excluding a display section, and therefore, the border (outer periphery) of the insulating layer (60) does not approach a region where an NCF (81) is provided, i.e., an area close to an LSI chip (40). This prevents the insulating layer (60) from being peeled off from the border thereof by the NCF (81), and thereby prevents the terminal (24) from breaking. Furthermore, the terminal (24) and a bump electrode (40a) are permanently pressure-bonded to each other by the elasticity of the insulating layer (60), and a stable electrical connection therebetween can be ensured.

摘要翻译： 公开了一种器件基板，其中在其表面上形成有端子（24）的绝缘层（60）形成在除了显示部分之外的玻璃基板（20）的整个表面上，因此，边界（外围 绝缘层（60）不接近设置有NCF（81）的区域，即靠近LSI芯片（40）的区域。 这防止绝缘层（60）被NCF（81）从其边界剥离，从而防止端子（24）断裂。 此外，端子（24）和突起电极（40a）通过绝缘层（60）的弹性而彼此永久地压接，并且可以确保其间的稳定的电连接。

公开(公告)号：US20120063281A1

公开(公告)日：2012-03-15

申请号：US13228222

申请日：2011-09-08

申请人： Shinzoh MURAKAMI ,  Mototaka Taneya ,  Takahide Ishigro ,  Katsushige Masui ,  Satoru Fukumoto ,  Takeshi Horiguchi

发明人： Shinzoh MURAKAMI ,  Mototaka Taneya ,  Takahide Ishigro ,  Katsushige Masui ,  Satoru Fukumoto ,  Takeshi Horiguchi

IPC分类号： G11B7/125 ,  H01L21/68 ,  G02B27/42

CPC分类号： G11B7/1353 ,  G11B7/1275

摘要： In a diffractive element, its grating pattern is so configured that a diffraction angle of a diffracted light beam of a light source that is subject to the first-order diffraction in a diffraction area is matched with an angle of a light beam passing through the diffractive area emitted from a light source and a light source position is matched with a light originating point of the light source that emits a light beam to be transmitted, and the center of light intensity distribution is matched with that of the light source passing through the diffractive element by inclining an optical axis of the light source. A position of the diffractive element is adjusted based on an electric current value generated when a reflected return path light beam of the light source is diffracted by the diffractive element and enters the light source.

摘要翻译： 在衍射元件中，其光栅图案被配置为使得衍射区域中经受一次衍射的光源的衍射光束的衍射角与通过衍射的光束的角度相匹配 从光源和光源位置发射的区域与发射要透射的光束的光源的发光点相匹配，并且光强度分布的中心与通过衍射的光源的光中心匹配 元件通过倾斜光源的光轴。 基于当光源的反射返回路径光束被衍射元件衍射并进入光源时产生的电流值来调节衍射元件的位置。

公开(公告)号：US06700911B2

公开(公告)日：2004-03-02

申请号：US09725513

申请日：2000-11-30

申请人： Ikuo Kohashi ,  Osamu Hamaoka ,  Takeshi Horiguchi

发明人： Ikuo Kohashi ,  Osamu Hamaoka ,  Takeshi Horiguchi

IPC分类号： H01S500

CPC分类号： H01S5/0226 ,  H01S5/005 ,  H01S5/02236 ,  H01S5/02268 ,  H01S2301/02

摘要： In a semiconductor laser device, a semiconductor laser chip is placed on a stem so that an end surface of the semiconductor laser chip, on which the main radiation side light emission point is located, protrudes from an edge of a header portion of the stem or from an edge of a header portion of a sub-mount provided on the stem so as to conceal no light emission points of the semiconductor. A conductive die bonding paste is used for the die bonding of the semiconductor laser chip. A chamfered portion or a rounded corner portion is formed at the edge of the header portion of the stem or the edge of the header portion of the sub-mount provided on the stem. Also, an optical pickup is constructed of at least the semiconductor laser device, a diffraction grating, a photodetector, a condenser lens and an object lens.

摘要翻译： 在半导体激光器件中，将半导体激光器芯片放置在杆上，使得主辐射侧发光点所在的半导体激光器芯片的端面从杆的头部的边缘突出，或 从设置在杆上的副安装座的集管部分的边缘开始，以便不隐藏半导体的发光点。 导电芯片粘接膏用于半导体激光芯片的裸片接合。 在杆的集管部分的边缘或设置在杆上的副安装座的集管部分的边缘处形成倒角部分或圆角部分。 此外，光学拾取器至少由半导体激光器件，衍射光栅，光电检测器，聚光透镜和物镜构成。

公开(公告)号：US08299631B2

公开(公告)日：2012-10-30

申请号：US13061456

申请日：2009-06-11

申请人： Takeshi Horiguchi ,  Takashi Matsui ,  Motoji Shiota

发明人： Takeshi Horiguchi ,  Takashi Matsui ,  Motoji Shiota

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H05K1/111 ,  G02F1/1345 ,  G02F1/13452 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L2224/14152 ,  H01L2224/14155 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K2201/0784 ,  H05K2201/09227 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/29075

摘要： Provided is a semiconductor element in which decrease in reliability of wiring is suppressed. A driver IC (10) has a plurality of output bumps (12) arranged in the direction (direction A) along the long sides (11a and 11b). The output bumps include a plurality of source bumps (12a) arranged near the center section of the long side, and a plurality of gate bumps (12b) arranged towards the end portions of the long side. The source bumps are arranged close to the long side (11a), and the gate bumps are arranged closer to the long side (11b) than the source bumps.

摘要翻译： 提供了抑制布线可靠性降低的半导体元件。 驱动器IC（10）具有沿着长边（11a和11b）沿方向（方向A）排列的多个输出凸块（12）。 输出凸块包括设置在长边的中心部附近的多个源极凸块（12a）和朝向长边的端部排列的多个栅极凸块（12b）。 源极凸块靠近长边（11a）布置，并且栅极凸块比源极凸点更靠近长边（11b）布置。

公开(公告)号：US20120080789A1

公开(公告)日：2012-04-05

申请号：US13377780

申请日：2010-02-02

申请人： Motoji Shiota ,  Hiroki Nakahama ,  Takashi Matsui ,  Takeshi Horiguchi

发明人： Motoji Shiota ,  Hiroki Nakahama ,  Takashi Matsui ,  Takeshi Horiguchi

IPC分类号： H01L23/498

CPC分类号： H01L24/14 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13013 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14133 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/14151 ,  H01L2224/14152 ,  H01L2224/14153 ,  H01L2224/14155 ,  H01L2224/14156 ,  H01L2224/14177 ,  H01L2224/16225 ,  H01L2224/17517 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/381 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/13099 ,  H01L2224/81 ,  H01L2224/83

摘要： Provided is a semiconductor chip having a narrowed pitch between terminals, the chip being capable of suppressing occurrence of poor connection between the chip and a substrate on which the chip is mounted. In an LSI chip including an input bump group, which is composed of a plurality of input bumps aligned in a line along one long side of its bottom surface, and an output bump group, which is composed of a plurality of output bumps arranged in a staggered manner along the other long side of the bottom surface, a dummy bump group is provided in an area between an area where the input bump group is provided and an area where the output bump group is provided, the dummy bump group including a plurality of rectangular dummy bumps which have long side extending along a direction perpendicular to the long sides of the bottom surface.

摘要翻译： 提供了一种在端子之间具有窄间距的半导体芯片，该芯片能够抑制芯片与其上安装芯片的基板之间的连接不良的发生。 在包括输入凸块组的LSI芯片中，所述输入凸块组由沿其底面的一个长边排列的多个输入凸块和输出凸块组组成，所述输出凸块组由多个输出凸块组成， 沿着底面的另一长边交错排列，在设置有输入凸块组的区域和设置有输出凸块组的区域之间的区域中设置有虚设凸块组，该虚设凸块组包括多个 具有沿着与底面的长边垂直的方向延伸的长边的矩形伪凸块。

公开(公告)号：US20090140416A1

公开(公告)日：2009-06-04

申请号：US12292672

申请日：2008-11-24

申请人： Masaya Ishida ,  Daisuke Hanaoka ,  Takeshi Horiguchi

发明人： Masaya Ishida ,  Daisuke Hanaoka ,  Takeshi Horiguchi

IPC分类号： H01L23/04 ,  B65D85/00

CPC分类号： H01S5/02212 ,  H01L2224/48091 ,  H01L2924/19107 ,  H01S5/02296 ,  H01L2924/00014

摘要： A cap member capable of alleviating degradation of reliability and improving fabrication yields is provided. The cap member has a cylindrical side wall portion, a top face portion closing one end of the side wall portion and having a light exit hole formed therein to allow extraction of laser light from a semiconductor laser chip; a light transmission window fitted to the top face portion to stop the light exit hole, and a flange portion arranged at the other end of the side wall portion and welded on the upper face of a stem on which the semiconductor laser chip is mounted. A groove portion is formed in an inner surface of the top face portion, and this groove portion makes part of the top face portion in a predetermined region less thick than the other part thereof.

摘要翻译： 提供了能够减轻可靠性降低并提高制造成品率的盖构件。 盖构件具有圆筒形侧壁部分，顶面部分，其封闭侧壁部分的一端并且具有形成在其中的光出射孔，以允许从半导体激光芯片提取激光; 安装在顶面部上以阻止光射出孔的光透射窗，以及布置在侧壁部分的另一端并焊接在其上安装半导体激光芯片的杆的上表面上的凸缘部分。 在顶面部的内表面形成有槽部，该槽部使顶面部的一部分成为比其他部分厚的规定区域。