发明申请
US20090145766A1 ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD, AND PRODUCTION METHOD OF PRINTED WIRING BOARD
有权
粘合剂助剂 - 承载金属箔，印刷线路板和印刷线路板的生产方法
- 专利标题： ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD, AND PRODUCTION METHOD OF PRINTED WIRING BOARD
- 专利标题（中）： 粘合剂助剂 - 承载金属箔，印刷线路板和印刷线路板的生产方法
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申请号： US12368019申请日： 2009-02-09
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公开(公告)号： US20090145766A1公开(公告)日： 2009-06-11
- 发明人: Kenji TAKAI , Norio Moriike , Kenichi Kamiyama , Takako Watanabe , Shin Takanezawa , Koji Morita , Katsuyuki Masuda , Kiyoshi Hasegawa
- 申请人： Kenji TAKAI , Norio Moriike , Kenichi Kamiyama , Takako Watanabe , Shin Takanezawa , Koji Morita , Katsuyuki Masuda , Kiyoshi Hasegawa
- 优先权： JP2004-024456 20040130; JP2004-116726 20040412
- 主分类号： C25D5/02
- IPC分类号： C25D5/02 ; C25D5/48
摘要：
The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.
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