An interconnection element can be formed by plating a metal layer within holes in an essentially non-metallic layer of a mandrel, wherein posts can be plated onto a metal layer exposed within the holes, e.g., a metal layer covering the holes in the non-metallic layer. The tips of the posts can be formed adjacent to ends or bottoms of the blind holes. Terminals can be formed in conductive communication with the conductive posts. The terminals can be connected through a dielectric layer to the conductive posts. At least a portion of the mandrel can then be removed from at least ends of the holes. In this way, the tips of the conductive posts can become raised above a major surface of the interconnection element such that at least the tips of the posts project beyond the major surface.