发明申请
- 专利标题: PROCESSING APPARATUS
- 专利标题(中): 加工设备
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申请号: US12334130申请日: 2008-12-12
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公开(公告)号: US20090151433A1公开(公告)日: 2009-06-18
- 发明人: Wei Gao , Young Jin Noh , Yoshikazu Arai , Hirokazu Odagiri
- 申请人: Wei Gao , Young Jin Noh , Yoshikazu Arai , Hirokazu Odagiri
- 申请人地址: JP Miyagi JP Tokyo
- 专利权人: TOHOKU TECHNO ARCH CO., LTD.,SONY CORPORATION
- 当前专利权人: TOHOKU TECHNO ARCH CO., LTD.,SONY CORPORATION
- 当前专利权人地址: JP Miyagi JP Tokyo
- 优先权: JP2007-324022 20071214
- 主分类号: B23Q17/09
- IPC分类号: B23Q17/09
摘要:
A processing apparatus is provided. The processing apparatus includes a processing portion, an actuator, a casing, a preload mechanism, a force sensor, and a detection unit. The processing portion includes a cutting edge. The actuator is configured to cause the processing portion to vibrate microscopically. The casing is configured to accommodate the actuator. The preload mechanism is disposed inside the casing and configured to impart a preload to the actuator. The force sensor is disposed between the cutting edge and the preload mechanism. The detection unit detects a cutting force of the processing portion based on an output of the force sensor.
公开/授权文献
- US07942063B2 Processing apparatus 公开/授权日:2011-05-17
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