发明申请
- 专利标题： SENSOR DEVICE AND PRODUCTION METHOD THEREFOR
- 专利标题（中）： 传感器及其生产方法
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申请号： US12094771申请日： 2006-11-24
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公开(公告)号： US20090152656A1公开(公告)日： 2009-06-18
- 发明人: Takafumi Okudo , Yuji Suzuki , Yoshiyuki Takegawa , Toru Baba , Kouji Gotou , Hisakazu Miyajima , Kazushi Kataoka , Takashi Saijo
- 申请人： Takafumi Okudo , Yuji Suzuki , Yoshiyuki Takegawa , Toru Baba , Kouji Gotou , Hisakazu Miyajima , Kazushi Kataoka , Takashi Saijo
- 优先权： JP2005-341223 20051125; JP2005-341225 20051125; JP2005-341253 20051125; JP2005-371049 20051222; JP2005-371053 20051222; JP2006-089555 20060328; JP2006-089558 20060328; JP2006-089582 20060328; JP2006-089583 20060328; JP2006-089586 20060328; JP2006-089589 20060328
- 国际申请： PCT/JP2006/323459 WO 20061124
- 主分类号： H01L29/84
- IPC分类号： H01L29/84 ; H01L21/50
摘要：
A compact sensor device having stable sensor characteristics and the production method are provided. The sensor device is formed with a sensor substrate and a pair of package substrates bonded to both surface of the sensor substrate. The sensor substrate has a frame with an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Surface-activated regions are formed on the frame of the sensor substrate and the package substrates by use of an atomic beam, an ion beam or a plasma of an inert gas. By forming a direct bonding between the surface-activated regions of the sensor substrate and each of the package substrates at room temperature, it is possible to avoid inconvenience resulting from residual stress at the bonding portion.
公开/授权文献
- US07674638B2 Sensor device and production method therefor 公开/授权日：2010-03-09
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