Semiconductor acceleration sensor and method of manufacturing the same
    1.
    发明授权
    Semiconductor acceleration sensor and method of manufacturing the same 失效
    半导体加速度传感器及其制造方法

    公开(公告)号:US07107847B2

    公开(公告)日:2006-09-19

    申请号:US10867701

    申请日:2004-06-16

    IPC分类号: G01P15/12

    摘要: A semiconductor acceleration sensor comprises: a frame having an opening inside thereof; flexible beams extending from the frame to the inside of the opening of the frame; a weight suspended from and supported by the beams so that the weight can freely move; piezoresistors to be mounted on the beams and to vary the resistance values in response to accelerations which work on the piezoresistors. The frame comprises damper plate portions, each of which covers a part of the opening spanning from a corner portion of two neighboring sides of the frame on the side of the opening to the inside of the opening, and each of which serves serve as a stopper to limit movement of the weight. The weight has corner portions which face the corner portions, respectively, and each of which is chamfered to have a shape of arc or a polygonal line consisting of at least three sides as seen in plan view. Thereby, the breaking strength of each stopper is increased, and hence a semiconductor acceleration sensor having superior shock resistance can be obtained.

    摘要翻译: 半导体加速度传感器包括:在其内部具有开口的框架; 从框架延伸到框架的开口的内部的柔性梁; 由梁悬挂和支撑的重物,使重物能自由移动; 压敏电阻器被安装在光束上并且响应于在压敏电阻器上工作的加速度来改变电阻值。 框架包括阻尼板部分,每个阻挡板部分覆盖从开口至开口内侧的框架的两个相邻侧的角部的开口的一部分,每个开口用作止动件 限制重量的移动。 该重量具有分别面对拐角部分的角部,并且如平面图所示,每个角部被倒角成具有由至少三个侧面组成的弧形或多边形线。 因此,每个制动器的断裂强度增加,因此可以获得具有优异抗冲击性的半导体加速度传感器。

    Capacitive sensor
    2.
    发明授权
    Capacitive sensor 有权
    电容传感器

    公开(公告)号:US08176782B2

    公开(公告)日:2012-05-15

    申请号:US12296554

    申请日:2007-04-25

    IPC分类号: G01P15/125

    摘要: A capacitive sensor includes a fixed electrode and a movable electrode that is movably supported by an anchor portion through a beam portion. The fixed electrode and the movable electrode are opposed to each other with a gap interposed therebetween, thereby constituting a detecting unit. A capacitance suitable for a size of the gap is detected to detect a predetermined physical value. At least one of an end of the beam portion connected to the anchor portion and an end of the beam portion connected to the movable electrode is provided with a stress moderating unit that moderates a stress.

    摘要翻译: 电容式传感器包括固定电极和可动电极,其通过梁部分由锚固部分可移动地支撑。 固定电极和可动电极彼此间隔开间隔开,构成检测部。 检测适合于间隙尺寸的电容以检测预定的物理值。 连接到锚固部分的梁部分的端部和连接到可动电极的梁部分的端部中的至少一个设置有缓和应力的应力调节单元。

    Capacitive sensor
    4.
    发明授权
    Capacitive sensor 有权
    电容传感器

    公开(公告)号:US07554340B2

    公开(公告)日:2009-06-30

    申请号:US11689663

    申请日:2007-03-22

    IPC分类号: G01R27/26 G01P15/125

    摘要: A capacitive sensor includes an error compensating unit that, in an arrangement that a part of a fixed electrode as an edge portion and a part of a movable electrode as an edge portion are opposed to each other keeping a gap in a direction of shift of a detecting unit, reduces a detection error of capacitance due to the shift of comb-tooth portions from each other in the detecting unit, by a change of capacitance according to variation of the gap caused by the shift.

    摘要翻译: 一种电容式传感器包括:误差补偿单元,其以作为边缘部分的固定电极的一部分和作为边缘部分的可动电极的一部分彼此相对的方式保持沿着 检测单元通过根据由偏移引起的间隙的变化的电容的变化,减少由于检测单元中的梳齿部彼此的偏移引起的电容的检测误差。

    Sensor device and production method therefor
    8.
    发明授权
    Sensor device and production method therefor 失效
    传感器装置及其制作方法

    公开(公告)号:US08026594B2

    公开(公告)日:2011-09-27

    申请号:US12094772

    申请日:2006-11-24

    IPC分类号: H01L23/12

    摘要: A sensor device having small variations in sensor characteristics and improved resistance to electrical noise is provided. This sensor device has a sensor unit, which is provided with a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion, and a package substrate made of a semiconductor material, and bonded to a surface of the sensor unit. The package substrate has an electrical insulating film on a surface facing the sensor unit. The package substrate is bonded to the sensor unit by forming a direct bonding between an activated surface of the electrical insulating film and an activated surface of the sensor unit at room temperature.

    摘要翻译: 提供了传感器特性变化小,电噪声提高的传感器装置。 该传感器装置具有传感器单元,该传感器单元设置有具有开口的框架,保持在开口中的可移动部分,以相对于框架可移动;以及检测部分,用于根据可移动的位移位移输出电信号 部分,以及由半导体材料制成的封装衬底,并结合到传感器单元的表面。 封装基板在面向传感器单元的表面上具有电绝缘膜。 通过在室温下在电绝缘膜的活化表面和传感器单元的活化表面之间形成直接接合,封装衬底结合到传感器单元。