发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM FOR SHIELDING ELECTROMAGNETIC INTERFERENCE
- 专利标题（中）： 用于屏蔽电磁干扰的集成电路封装系统
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申请号： US11956132申请日： 2007-12-13
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公开(公告)号： US20090152688A1公开(公告)日： 2009-06-18
- 发明人: Byung Tai Do , Heap Hoe Kuan , Rui Huang
- 申请人： Byung Tai Do , Heap Hoe Kuan , Rui Huang
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L21/58
摘要：
An integrated circuit package system comprising: providing a substrate; coupling an integrated circuit to the substrate; mounting a shielding element around the integrated circuit; applying a conductive shielding layer on the shielding element; and coupling a system interconnect to the shielding element.
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