公开(公告)号：US08368188B2

公开(公告)日：2013-02-05

申请号：US12912728

申请日：2010-10-26

申请人： Byung Tai Do ,  Heap Hoe Kuan ,  Rui Huang

发明人： Byung Tai Do ,  Heap Hoe Kuan ,  Rui Huang

IPC分类号： H01L23/495

CPC分类号： H01L23/49548 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing an integrated circuit package system includes: providing an integrated circuit; mounting a lead on the periphery of the integrated circuit; connecting the integrated circuit to the lead with an interconnect; and forming a conformable material by pressing the conformable material on the integrated circuit, the lead, and the interconnect.

摘要翻译： 一种用于制造集成电路封装系统的方法，包括：提供集成电路; 在集成电路的外围安装引线; 通过互连将集成电路连接到引线; 以及通过在集成电路，引线和互连上按压适形材料来形成适形材料。

公开(公告)号：US20120104599A1

公开(公告)日：2012-05-03

申请号：US13335867

申请日：2011-12-22

申请人： Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Linda Pei Ee Chua ,  Rui Huang

发明人： Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Linda Pei Ee Chua ,  Rui Huang

IPC分类号： H01L23/498 ,  H01L23/48

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor wafer is made by forming a first conductive layer over a sacrificial substrate, mounting a semiconductor die to the sacrificial substrate, depositing an insulating layer over the semiconductor die and first conductive layer, exposing the first conductive layer and contact pad on the semiconductor die, forming a second conductive layer over the insulating layer between the first conductive layer and contact pad, forming solder bumps on the second conductive layer, depositing an encapsulant over the semiconductor die, first conductive layer, and interconnect structure, and removing the sacrificial substrate after forming the encapsulant to expose the conductive layer and semiconductor die. A portion of the encapsulant is removed to expose a portion of the solder bumps. The solder bumps are sized so that each extends the same outside the encapsulant. The semiconductor die are stacked by electrically connecting the solder bumps.

摘要翻译： 通过在牺牲衬底上形成第一导电层，将半导体管芯安装到牺牲衬底上，在半导体管芯和第一导电层上方沉积绝缘层，暴露半导体管芯上的第一导电层和接触焊盘来制造半导体晶片 在所述第一导电层和所述接触焊盘之间的所述绝缘层之上形成第二导电层，在所述第二导电层上形成焊料凸块，在所述半导体管芯上方沉积密封剂，所述第一导电层和互连结构， 形成密封剂以暴露导电层和半导体管芯。 去除一部分密封剂以露出焊料凸块的一部分。 焊料凸块的尺寸设计成使得每个焊料凸块在封装体外均延伸。 通过电连接焊料凸块来堆叠半导体管芯。

公开(公告)号：US08049314B2

公开(公告)日：2011-11-01

申请号：US12126684

申请日：2008-05-23

申请人： Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Linda Pei Ee Chua ,  Rui Huang

发明人： Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Linda Pei Ee Chua ,  Rui Huang

IPC分类号： H01L23/495 ,  H01L21/58

CPC分类号： H01L23/49548 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: providing a connection array; attaching a base integrated circuit adjacent the connection array; attaching a package integrated circuit over the base integrated circuit; attaching a package die connector to the package integrated circuit and the connection array; and applying a wire-in-film insulator over the package integrated circuit, the package die connector, the base integrated circuit, and the connection array, wherein the connection array is partially exposed.

摘要翻译： 集成电路封装系统包括：提供连接阵列; 将基座集成电路附接在连接阵列附近; 将封装集成电路连接到基极集成电路上; 将封装管芯连接器附接到封装集成电路和连接阵列; 以及在封装集成电路，封装管芯连接器，基底集成电路和连接阵列上施加线内绝缘体，其中连接阵列部分暴露。

公开(公告)号：US20090230531A1

公开(公告)日：2009-09-17

申请号：US12047979

申请日：2008-03-13

申请人： Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Linda Pei Ee Chua ,  Rui Huang

发明人： Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Linda Pei Ee Chua ,  Rui Huang

IPC分类号： H01L23/02 ,  H01L21/56

CPC分类号： H01L21/56 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L25/03 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is made by mounting a first semiconductor die to a first substrate, forming a first encapsulant over the first semiconductor die, and forming a second encapsulant over the first encapsulant. The second encapsulant is penetrable, thermally conductive material. A second semiconductor die is mounted to the second substrate. A bond wire electrically connects the second semiconductor die to the second substrate. A passive circuit element is mounted to the second substrate. Leading with the second encapsulant, the first substrate is pressed onto the second substrate so that the second encapsulant completely covers the second semiconductor die, bond wire, and passive circuit element. The second encapsulant is then cured. A third encapsulant is formed over the first and second substrates. A shield can be disposed over the second semiconductor die with openings for the second encapsulant to flow through when pressed onto the second substrate.

摘要翻译： 半导体器件通过将第一半导体管芯安装到第一衬底上，在第一半导体管芯上形成第一密封剂，并在第一密封剂上形成第二密封剂。 第二密封剂是可穿透的导热材料。 第二半导体管芯安装到第二衬底。 接合线将第二半导体管芯电连接到第二基板。 无源电路元件安装到第二基板。 利用第二密封剂引导第一衬底被压在第二衬底上，使得第二密封剂完全覆盖第二半导体管芯，接合线和无源电路元件。 然后固化第二密封剂。 在第一和第二基板上形成第三密封剂。 可以在第二半导体管芯上设置屏蔽件，其具有用于第二密封剂的开口，当第二密封剂被压在第二衬底上时流过。

公开(公告)号：US20090212429A1

公开(公告)日：2009-08-27

申请号：US12036000

申请日：2008-02-22

申请人： Byung Tai Do ,  Heap Hoe Kuan ,  Yaojian Lin ,  Rui Huang

发明人： Byung Tai Do ,  Heap Hoe Kuan ,  Yaojian Lin ,  Rui Huang

IPC分类号： H01L23/52 ,  H01L21/44

CPC分类号： H01L24/11 ,  H01L21/304 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/1131 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00014

摘要： A semiconductor device is made by providing a semiconductor wafer having an active surface, forming an under bump metallization layer on the active surface of the semiconductor wafer, forming a first photosensitive layer on the active surface of the semiconductor wafer, exposing a selected portion of the first photosensitive layer over the under bump metallization layer to light, removing a portion of a backside of the semiconductor wafer, opposite to the active surface, prior to developing the exposed portion of the first photosensitive layer, developing the exposed portion of the first photosensitive layer after removing the portion of the backside of the semiconductor wafer, and depositing solder material over the under bump metallization layer to form solder bumps. The remaining portion of the first photosensitive layer is then removed. A second photosensitive layer or metal stencil can be formed over the first photosensitive layer.

摘要翻译： 通过提供具有活性表面的半导体晶片制造半导体器件，在半导体晶片的有源表面上形成凸起下金属化层，在半导体晶片的有源表面上形成第一感光层，将所选择的部分 在凸起下金属化层之上的第一感光层进行光照射，在显影第一感光层的暴露部分之前，移除与有源表面相对的半导体晶片的背面的一部分，将第一感光层的暴露部分 在去除半导体晶片的背面的部分之后，并且将焊料材料沉积在凸块下金属化层上以形成焊料凸块。 然后除去第一感光层的剩余部分。 可以在第一感光层上形成第二感光层或金属模版。

公开(公告)号：US20090152688A1

公开(公告)日：2009-06-18

申请号：US11956132

申请日：2007-12-13

申请人： Byung Tai Do ,  Heap Hoe Kuan ,  Rui Huang

发明人： Byung Tai Do ,  Heap Hoe Kuan ,  Rui Huang

IPC分类号： H01L23/552 ,  H01L21/58

CPC分类号： H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49179 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16195 ,  H01L2924/1626 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system comprising: providing a substrate; coupling an integrated circuit to the substrate; mounting a shielding element around the integrated circuit; applying a conductive shielding layer on the shielding element; and coupling a system interconnect to the shielding element.

摘要翻译： 一种集成电路封装系统，包括：提供衬底; 将集成电路耦合到所述衬底; 将屏蔽元件安装在集成电路周围; 在屏蔽元件上施加导电屏蔽层; 并将系统互连件耦合到屏蔽元件。

公开(公告)号：US20090146269A1

公开(公告)日：2009-06-11

申请号：US11952968

申请日：2007-12-07

申请人： Seng Guan Chow ,  Byung Tai Do ,  Heap Hoe Kuan ,  Rui Huang

发明人： Seng Guan Chow ,  Byung Tai Do ,  Heap Hoe Kuan ,  Rui Huang

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system includes: forming a first lead and a second lead; connecting an integrated circuit die with the first lead; forming an encapsulation over the integrated circuit die, the first lead, and the second lead with a portion of a top side of the second lead exposed; and forming a shield over the encapsulation, the first lead, and the second lead with the shield not in contact with the first lead.

摘要翻译： 集成电路封装系统包括：形成第一引线和第二引线; 将集成电路管芯与第一引线连接; 在所述集成电路管芯上形成封装，所述第一引线和所述第二引线与所述第二引线的顶侧的一部分暴露; 以及在所述封装，所述第一引线和所述第二引线上形成屏蔽件，所述屏蔽件不与所述第一引线接触。

公开(公告)号：US20090146268A1

公开(公告)日：2009-06-11

申请号：US11952951

申请日：2007-12-07

申请人： Rui Huang ,  Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan

发明人： Rui Huang ,  Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan

IPC分类号： H01L23/552 ,  H01L21/60

CPC分类号： H01L21/6835 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system comprising: providing a lead frame; forming an integrated circuit package including the lead frame; providing a selectively exposed area on the lead frame; and coating a conductive shielding layer on the integrated circuit package for coupling the selectively exposed area.

摘要翻译： 一种集成电路封装系统，包括：提供引线框架; 形成包括引线框架的集成电路封装; 在引线框架上提供选择性地暴露的区域; 以及在所述集成电路封装上涂覆导电屏蔽层，以连接所述选择性暴露区域。

公开(公告)号：US20090127683A1

公开(公告)日：2009-05-21

申请号：US12126684

申请日：2008-05-23

申请人： Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Linda Pei Ee Chua ,  Rui Huang

发明人： Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Linda Pei Ee Chua ,  Rui Huang

IPC分类号： H01L23/495 ,  H01L21/58

CPC分类号： H01L23/49548 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: providing a connection array; attaching a base integrated circuit adjacent the connection array; attaching a package integrated circuit over the base integrated circuit; attaching a package die connector to the package integrated circuit and the connection array; and applying a wire-in-film insulator over the package integrated circuit, the package die connector, the base integrated circuit, and the connection array, wherein the connection array is partially exposed.

摘要翻译： 集成电路封装系统包括：提供连接阵列; 将基座集成电路附接在连接阵列附近; 将封装集成电路连接到基极集成电路上; 将封装管芯连接器附接到封装集成电路和连接阵列; 以及在封装集成电路，封装管芯连接器，基底集成电路和连接阵列上施加线内绝缘体，其中连接阵列部分暴露。

公开(公告)号：US08492204B2

公开(公告)日：2013-07-23

申请号：US13081011

申请日：2011-04-06

申请人： Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Linda Pei Ee Chua ,  Rui Huang

发明人： Byung Tai Do ,  Seng Guan Chow ,  Heap Hoe Kuan ,  Linda Pei Ee Chua ,  Rui Huang

IPC分类号： H01L21/44

CPC分类号： H01L23/49548 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing a multiple encapsulation integrated circuit package-in-package system includes: dicing a top integrated circuit wafer having a bottom encapsulant thereon to form a top integrated circuit die with the bottom encapsulant; positioning internal leadfingers adjacent and connected to a bottom integrated circuit die; pressing the bottom encapsulant on to the bottom integrated circuit die; connecting the top integrated circuit die to external leadfingers adjacent the internal leadfingers; and forming a top encapsulant over the top integrated circuit die.

摘要翻译： 一种用于制造多封装集成电路封装包装系统的方法，包括：在其上划分具有底部密封剂的顶部集成电路晶片，以形成具有底部密封剂的顶部集成电路裸片; 将内部引线定位在相邻并连接到底部集成电路管芯上; 将底部密封剂压在底部集成电路模具上; 将顶部集成电路管芯连接到与内部引线管相邻的外部引线管; 以及在顶部集成电路管芯上形成顶部密封剂。