发明申请
- 专利标题： Soldering method
- 专利标题（中）： 焊接方法
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申请号： US12316106申请日： 2008-12-08
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公开(公告)号： US20090159649A1公开(公告)日： 2009-06-25
- 发明人: Yasushi Inoue
- 申请人： Yasushi Inoue
- 优先权： JP2007-330401 20071221
- 主分类号： B23K31/02
- IPC分类号： B23K31/02
摘要：
Embodiments of the present invention provide a soldering method capable of satisfactorily melting a solder without damaging a workpiece be soldered. One embodiment of a soldering method removes component waves of predetermined wavelengths from a light beam emitted by a light source and melts a solder by irradiating the solder with a light beam obtained by removing the component waves of the predetermined wavelengths from the light beam emitted by the light source.
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