发明申请
US20090168827A1 Nitride semiconductor laser chip and method of fabricating same
审中-公开
氮化物半导体激光芯片及其制造方法
- 专利标题: Nitride semiconductor laser chip and method of fabricating same
- 专利标题(中): 氮化物半导体激光芯片及其制造方法
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申请号: US12318237申请日: 2008-12-23
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公开(公告)号: US20090168827A1公开(公告)日: 2009-07-02
- 发明人: Toshiyuki Kawakami , Takeshi Kamikawa , Kentaro Tani
- 申请人: Toshiyuki Kawakami , Takeshi Kamikawa , Kentaro Tani
- 专利权人: SHARP KABUSHIKI KAISHA
- 当前专利权人: SHARP KABUSHIKI KAISHA
- 优先权: JP2007-333707 20071226
- 主分类号: H01S5/00
- IPC分类号: H01S5/00 ; H01L21/02
摘要:
A nitride semiconductor laser chip is provided that can not only improve its COD level but also prevent its I-L characteristic curve from rising steeply and that can reduce an operating voltage. The nitride semiconductor laser chip includes layers constituting a nitride semiconductor layer and formed on an n-type GaN substrate, mirror facets including a light emission mirror facet and a light reflection mirror facet, a p-side ohmic contact formed on an upper contact layer to reach the mirror facets and a p-side pad contact formed in a region only a distance L1 away from the light emission mirror facet. The thickness d of the p-side ohmic contact and the distance L1 from the p-side ohmic contact to the light emission mirror facet are adjusted such that the amount of current injected into the light emission mirror facet is 20% or more but 70% or less of the amount of current injected into an area directly below the p-side pad contact.
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