发明申请
- 专利标题： SIMULTANEOUS GRAIN MODULATION FOR BEOL APPLICATIONS
- 专利标题（中）： 用于BEOL应用的同时颗粒调节
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申请号： US11970149申请日： 2008-01-07
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公开(公告)号： US20090174075A1公开(公告)日： 2009-07-09
- 发明人: Chih-Chao Yang , Louis C. Hsu , Rajiv V. Joshi
- 申请人： Chih-Chao Yang , Louis C. Hsu , Rajiv V. Joshi
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/768
- IPC分类号： H01L21/768 ; H01L23/532
摘要：
The invention is directed to an improved semiconductor structure, such that within the same insulating layer, Cu interconnects embedded within the same insulating level layer have a different Cu grain size than other Cu interconnects embedded within the same insulating level layer.
公开/授权文献
- US07732922B2 Simultaneous grain modulation for BEOL applications 公开/授权日：2010-06-08
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