发明申请
US20090179180A1 Curable Organopolysiloxane Composition and Semiconductor Device
有权
固化有机聚硅氧烷组合物和半导体器件
- 专利标题: Curable Organopolysiloxane Composition and Semiconductor Device
- 专利标题(中): 固化有机聚硅氧烷组合物和半导体器件
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申请号: US12306049申请日: 2007-06-18
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公开(公告)号: US20090179180A1公开(公告)日: 2009-07-16
- 发明人: Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Makoto Yoshitake
- 申请人: Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Makoto Yoshitake
- 优先权: JPJP2006-173777 20060623
- 国际申请: PCT/JP2007/062649 WO 20070618
- 主分类号: C08F283/12
- IPC分类号: C08F283/12 ; H01J63/02
摘要:
A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: R13SiO(R12SiO)mSiR13 (where R1 is a monovalent hydrocarbon group, and “m” is an integer from 0 to 100); an organopolysiloxane (B) represented by the following average unit formula: (R2SiO3/2)a(R22SiO2/2)b(R23SiO1/2)c (where R2 is a monovalent hydrocarbon group, and “a”, “b”, and “c” are specific numbers); an organopolysiloxane (C) having in one molecule on average at least two silicon-bonded aryl groups and on average at least two silicon-bonded hydrogen atoms; and a hydrosilylation-reaction catalyst (D); is characterized by good fillability and curability and that, when cured, forms a cured body that possesses a high refractive index, high light transmissivity, and strong adhesion to various substrates.
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