发明申请
- 专利标题： SEMICONDUCTOR PACKAGE APPARATUS HAVING REDISTRIBUTION LAYER
- 专利标题（中）： 具有重新分配层的半导体封装设备
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申请号： US12355587申请日： 2009-01-16
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公开(公告)号： US20090184410A1公开(公告)日： 2009-07-23
- 发明人: Sang-Wook PARK , Min-Young SON , Hyeong-Seob KIM
- 申请人： Sang-Wook PARK , Min-Young SON , Hyeong-Seob KIM
- 申请人地址： KR Gyeonggi-do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR2008-0005330 20080117
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
Provided is a semiconductor package apparatus having a redistribution layer. The apparatus includes at least one or more semiconductor chips, a packing part protecting the semiconductor chips, and a support part supporting the semiconductor chips. The apparatus also includes external terminals extending outside the packing part, redistribution layers installed between the semiconductor chips and the support part and including redistribution paths, first signal transmitting units, and second signal transmitting units. The first signal transmitting units transmitting electrical signals generated from the semiconductor chips to the redistribution paths of the redistribution layers, and the second signal transmitting units transmit the electrical signals from the redistribution paths to the external terminals. Therefore, a size and a thickness of the semiconductor package apparatus can be reduced, and processes can be simplified to improve productivity.
公开/授权文献
- US08129826B2 Semiconductor package apparatus having redistribution layer 公开/授权日：2012-03-06
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