公开(公告)号：US20090184410A1

公开(公告)日：2009-07-23

申请号：US12355587

申请日：2009-01-16

申请人： Sang-Wook PARK ,  Min-Young SON ,  Hyeong-Seob KIM

发明人： Sang-Wook PARK ,  Min-Young SON ,  Hyeong-Seob KIM

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Provided is a semiconductor package apparatus having a redistribution layer. The apparatus includes at least one or more semiconductor chips, a packing part protecting the semiconductor chips, and a support part supporting the semiconductor chips. The apparatus also includes external terminals extending outside the packing part, redistribution layers installed between the semiconductor chips and the support part and including redistribution paths, first signal transmitting units, and second signal transmitting units. The first signal transmitting units transmitting electrical signals generated from the semiconductor chips to the redistribution paths of the redistribution layers, and the second signal transmitting units transmit the electrical signals from the redistribution paths to the external terminals. Therefore, a size and a thickness of the semiconductor package apparatus can be reduced, and processes can be simplified to improve productivity.

摘要翻译： 提供了具有再分配层的半导体封装装置。 该装置包括至少一个或多个半导体芯片，保护半导体芯片的封装部分和支撑半导体芯片的支撑部件。 该设备还包括延伸到包装部分外部的外部端子，重新分配层安装在半导体芯片和支撑部分之间，并且包括再分配路径，第一信号发送单元和第二信号发送单元。 所述第一信号发送单元将从所述半导体芯片生成的电信号发送到所述再分配层的再分配路径，并且所述第二信号发送单元将所述电信号从所述再分配路径发送到所述外部终端。 因此，可以减小半导体封装装置的尺寸和厚度，并且可以简化工艺以提高生产率。

公开(公告)号：US20060249823A1

公开(公告)日：2006-11-09

申请号：US11458640

申请日：2006-07-19

申请人： Hyeong-Seob KIM

发明人： Hyeong-Seob KIM

IPC分类号： H01L23/495

CPC分类号： H01L23/36 ,  H01L23/13 ,  H01L23/145 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package having an ultra thin thickness and a method of manufacturing the same are provided. The ultra thin semiconductor package comprises a circuit board in which a through hole is formed. A semiconductor chip is located in the through hole and a connecting element electrically connects the circuit board and the semiconductor chip. An epoxy molding compound (EMC) covers the semiconductor chip and the connecting element and a supporter having a thermal expansion coefficient similar to the EMC is attached inside the through hole on a lower surface of the semiconductor chip. An external connecting terminal is attached to at least one side of the circuit board. Because of the inclusion of the supporter, warpage of the semiconductor package resulting from the curing of the EMC is prevented.

摘要翻译： 提供了具有超薄厚度的半导体封装及其制造方法。 超薄半导体封装包括其中形成有通孔的电路板。 半导体芯片位于通孔中，并且连接元件电连接电路板和半导体芯片。 环氧树脂模塑料（EMC）覆盖半导体芯片，并且连接元件和具有类似于EMC的热膨胀系数的支撑件被安装在半导体芯片的下表面上的通孔的内部。 外部连接端子连接到电路板的至少一侧。 由于包含支撑体，防止了由固化EMC引起的半导体封装的翘曲。