发明申请
- 专利标题： Integrated Circuit Comprising Conductive Lines and Contact Structures and Method of Manufacturing an Integrated Circuit
- 专利标题（中）： 包含导电线路和接触结构的集成电路和制造集成电路的方法
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申请号： US12354140申请日： 2009-01-15
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公开(公告)号： US20090184429A1公开(公告)日： 2009-07-23
- 发明人: Andreas Thies , Sirko Kramp , Helmut Schneider , Rainer Florian Schnabel
- 申请人： Andreas Thies , Sirko Kramp , Helmut Schneider , Rainer Florian Schnabel
- 申请人地址： DE Muenchen
- 专利权人： Qimonda AG
- 当前专利权人： Qimonda AG
- 当前专利权人地址： DE Muenchen
- 优先权： DE102008004927.1 20080118
- 主分类号： H01L23/522
- IPC分类号： H01L23/522 ; H01L21/4763
摘要：
An integrated circuit comprises a first conductive lines and second lines as well as contact structures being in contact with the first and second conductive lines. The first conductive lines are arranged in a first metallization level, and second conductive lines are arranged in a second metallization level arranged above the first metallization level. The second conductive lines are arranged above the contact structures, and a pitch of neighboring contact structures is equal to a pitch of neighboring second conductive lines. The distance between neighboring contact structures is smaller than 100 nm.
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