发明申请
- 专利标题： POSITIVE RESIST COMPOSITIONS AND PATTERNING PROCESS
- 专利标题（中）： 积极的组合物和绘图过程
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申请号： US12355446申请日： 2009-01-16
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公开(公告)号： US20090186298A1公开(公告)日： 2009-07-23
- 发明人: Youichi OHSAWA , Takeshi Kinsho , Takeru Watanabe
- 申请人： Youichi OHSAWA , Takeshi Kinsho , Takeru Watanabe
- 优先权： JP2008-008750 20080118
- 主分类号： G03F7/20
- IPC分类号： G03F7/20 ; G03F7/004
摘要：
A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising specific recurring units, represented by formula (1). The acid generator (B) is a specific sulfonium salt compound. When processed by lithography, the composition is improved in resolution and forms a pattern with a satisfactory mask fidelity and a minimal LER. Herein R1 is H or methyl, R2 is an acid labile group, R3 is CO2R4 when X is CH2, R3 is H or CO2R4 when X is O, R4 is a monovalent C1-C20 hydrocarbon group, and m is 1 or 2.
公开/授权文献
- US07993811B2 Positive resist compositions and patterning process 公开/授权日：2011-08-09