发明申请
- 专利标题： SEMICONDUCTOR DEVICE WITH SEAL RING
- 专利标题（中）： 具有密封环的半导体器件
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申请号： US12410170申请日： 2009-03-24
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公开(公告)号： US20090189245A1公开(公告)日： 2009-07-30
- 发明人: Takeshi FURUSAWA , Noriko Miura , Kinya Goto , Masazumi Matsuura
- 申请人： Takeshi FURUSAWA , Noriko Miura , Kinya Goto , Masazumi Matsuura
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corporation
- 当前专利权人： Renesas Technology Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2004-264014 20040910
- 主分类号： H01L23/58
- IPC分类号： H01L23/58
摘要：
A semiconductor device according to the invention is a semiconductor device which includes a low dielectric constant film of which the relative dielectric constant is less than 3.5, is provided with one or more seal rings that are moisture blocking walls in closed loop form in a plan view, and where at least one of the seal rings includes a seal ring protrusion portion in inward protruding form in the vicinity of a chip corner.
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