发明申请
- 专利标题： SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- 专利标题（中）： 半导体芯片和半导体器件
-
申请号： US12348543申请日： 2009-01-05
-
公开(公告)号： US20090189276A1公开(公告)日： 2009-07-30
- 发明人: Hikari SANO , Yoshihiro Tomita , Takahiro Nakano
- 申请人： Hikari SANO , Yoshihiro Tomita , Takahiro Nakano
- 优先权： JP2008-018641 20080130
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A semiconductor chip, including: a substrate including an front surface; an integrated circuit formed on the front surface and including a plurality of semiconductor elements; and a heat-radiating plug formed in a region of the substrate corresponding to at least one of the semiconductor elements. The heat-radiating plug is made of a material having a thermal conductivity greater than that of the substrate formed in a non-penetrating hole having its opening on a reverse surface of the substrate.
公开/授权文献
- US08134231B2 Semiconductor chip and semiconductor device 公开/授权日：2012-03-13
信息查询
IPC分类:
