发明申请
- 专利标题： SEMICONDUCTOR LASER PACKAGE
- 专利标题（中）： 半导体激光封装
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申请号： US12363103申请日： 2009-01-30
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公开(公告)号： US20090190619A1公开(公告)日： 2009-07-30
- 发明人: Haihua Qi , Bifeng Xiong , Bin Jiang , Hong Ma
- 申请人： Haihua Qi , Bifeng Xiong , Bin Jiang , Hong Ma
- 申请人地址： CN Shenzhen
- 专利权人： Shenzhen Century Epitech Photonics Technology Co. Ltd.
- 当前专利权人： Shenzhen Century Epitech Photonics Technology Co. Ltd.
- 当前专利权人地址： CN Shenzhen
- 优先权： CN200820091982.X 20080130
- 主分类号： H01S5/024
- IPC分类号： H01S5/024
摘要：
The present invention provides a semiconductor laser package including a heat sink, a laser bar with a plurality of lasers on the heat sink, an insulated layer arranged between said heat sink and said laser bar, a solder layer combining said insulated layer with said laser bar, and a clearance crossing said solder layer defined between adjacent lasers.