Invention Application
- Patent Title: Semiconductor module, wiring board , and wiring method
- Patent Title (中): 半导体模块，接线板及接线方式
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Application No.: US12320641Application Date: 2009-01-30
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Publication No.: US20090196009A1Publication Date: 2009-08-06
- Inventor: Wataru TSUKADA
- Applicant: Wataru TSUKADA
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory,Inc.
- Current Assignee: Elpida Memory,Inc.
- Current Assignee Address: JP Tokyo
- Priority: JP2008-020088 20080131
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H05K3/30 ; H05K1/11
Abstract:
A semiconductor module includes a plurality of rectangular shaped semiconductor devices which are arranged in two rows such that each pair of adjacent semiconductor devices is in orientations differed by 90 degrees from each other. A plurality of wirings connect the semiconductor devices included in one of the two rows to the semiconductor devices included in the other row such that the semiconductor devices arranged in the same orientations are connected to each other.
Public/Granted literature
- US08054643B2 Semiconductor module, wiring board, and wiring method Public/Granted day:2011-11-08
Information query
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