公开(公告)号：US20110093764A1

公开(公告)日：2011-04-21

申请号：US12908512

申请日：2010-10-20

Applicant: Wataru TSUKADA ,  Shiro Harashima ,  Yoji Nishio

Inventor： Wataru TSUKADA ,  Shiro Harashima ,  Yoji Nishio

IPC: H03M13/05 ,  G06F11/10

CPC classification number: G06F11/1044 ,  H03M13/13

Abstract: Regular chip packages that store user data therein and error-correction chip packages that store an error correction code therein are mounted on a module substrate. The module substrate has first and second mounting areas of different coordinates in an X direction, and the second mounting area has third and fourth mounting areas of different Y coordinates. The regular packages are oppositely arranged in the first mounting area on a surface and the back surface of the module substrate. The error-correction chip packages are oppositely arranged in the third mounting area on the surface and the back surface of the module substrate. A memory buffer that buffers user data and an error correction code is arranged in the fourth mounting area.

Abstract translation: 将其中存储用户数据的常规芯片封装和存储其中的纠错码的纠错芯片封装安装在模块基板上。 模块基板在X方向上具有不同坐标的第一和第二安装区域，并且第二安装区域具有不同Y坐标的第三和第四安装区域。 常规包装件相对地布置在模块基板的表面和背面上的第一安装区域中。 纠错芯片封装相对地布置在模块基板的表面和背面上的第三安装区域中。 缓冲用户数据和纠错码的存储器缓冲器布置在第四安装区域中。

公开(公告)号：US20130010514A1

公开(公告)日：2013-01-10

申请号：US13540255

申请日：2012-07-02

Applicant: Wataru TSUKADA

Inventor： Wataru TSUKADA

IPC: G11C5/04

CPC classification number: H01L25/0655 ,  G11C5/04 ,  H01L25/0652 ,  H01L2924/0002 ,  H05K1/181 ,  H05K2201/10159 ,  H01L2924/00

Abstract: Disclosed herein is a semiconductor module that includes a module substrate and a plurality of semiconductor devices mounted on the module substrate. Among the semiconductor devices, two of the semiconductor devices adjacent in a first direction differ in a mounting direction by 180°. Among the semiconductor devices, two of the semiconductor devices adjacent in a second direction perpendicular to the first direction differing in a mounting direction by 180°.

Abstract translation: 这里公开了一种半导体模块，其包括模块基板和安装在模块基板上的多个半导体器件。 在半导体器件中，在第一方向上相邻的两个半导体器件在安装方向上不同180°。 在半导体器件中，在垂直于第一方向的第二方向上相邻的两个半导体器件在安装方向上相差180°。

公开(公告)号：US20090196009A1

公开(公告)日：2009-08-06

申请号：US12320641

申请日：2009-01-30

Applicant: Wataru TSUKADA

Inventor： Wataru TSUKADA

IPC: H01L23/538 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K2201/09245 ,  H05K2201/097 ,  H05K2201/10159 ,  H05K2201/10689 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A semiconductor module includes a plurality of rectangular shaped semiconductor devices which are arranged in two rows such that each pair of adjacent semiconductor devices is in orientations differed by 90 degrees from each other. A plurality of wirings connect the semiconductor devices included in one of the two rows to the semiconductor devices included in the other row such that the semiconductor devices arranged in the same orientations are connected to each other.

Abstract translation: 半导体模块包括多个矩形半导体器件，它们被布置成两行，使得每对相邻的半导体器件的取向彼此相差90度。 多个布线将包括在两行之一中的半导体器件连接到另一行中包括的半导体器件，使得以相同取向排列的半导体器件彼此连接。