发明申请
- 专利标题： Method for Reducing an Unevenness of a Surface and Method for Making a Semiconductor Device
- 专利标题（中）： 降低表面不均匀的方法及制造半导体器件的方法
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申请号： US12029262申请日： 2008-02-11
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公开(公告)号： US20090203220A1公开(公告)日： 2009-08-13
- 发明人: Joern Plagmann , Holger Poehle
- 申请人： Joern Plagmann , Holger Poehle
- 主分类号： H01L21/31
- IPC分类号： H01L21/31
摘要：
In order to reduce an unevenness of a surface of a body, a sacrificial layer is applied to the surface, a chemical-mechanical polishing of the sacrificial layer and material of said body is performed to reduce the unevenness of the surface, and a remainder of the sacrificial layer, if any, may be removed.
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