发明申请
- 专利标题: Semiconductor light-emitting device
- 专利标题(中): 半导体发光装置
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申请号: US12230234申请日: 2008-08-26
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公开(公告)号: US20090206354A1公开(公告)日: 2009-08-20
- 发明人: Nobuaki Kitano , Masahiro Arai , Kazuyuki Iizuka
- 申请人: Nobuaki Kitano , Masahiro Arai , Kazuyuki Iizuka
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Cable, Ltd.
- 当前专利权人: Hitachi Cable, Ltd.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2008-039271 20080220
- 主分类号: H01L33/00
- IPC分类号: H01L33/00
摘要:
A semiconductor light-emitting device includes a support structure, and a light-emitting structure. The support structure includes a support substrate, and a support substrate side bonding layer disposed on one surface of the support substrate. The light-emitting structure includes a light-emitting structure side bonding layer bonded to the support substrate side bonding layer, a reflection region disposed on the support substrate side bonding layer opposite the support substrate, and a semiconductor multilayer structure including a light-emitting layer disposed on the reflection region opposite the light-emitting structure side bonding layer for emitting a light with a predetermined wavelength, and a light-extraction surface disposed on the light-emitting layer opposite the reflection region for reflecting diffusely the light. The reflection region includes a transparent layer of a material with a lower refractive index than that of the semiconductor multilayer structure, and a reflection layer of a metallic material. The transparent layer has such a thickness that interference caused by multiple reflection of light inputted to the transparent layer can be suppressed.
公开/授权文献
- US08071992B2 Semiconductor light-emitting device 公开/授权日:2011-12-06
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