发明申请
US20090206405A1 FIN FIELD EFFECT TRANSISTOR STRUCTURES HAVING TWO DIELECTRIC THICKNESSES
审中-公开
具有两个电介质厚度的FIN场效应晶体管结构
- 专利标题: FIN FIELD EFFECT TRANSISTOR STRUCTURES HAVING TWO DIELECTRIC THICKNESSES
- 专利标题(中): 具有两个电介质厚度的FIN场效应晶体管结构
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申请号: US12032594申请日: 2008-02-15
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公开(公告)号: US20090206405A1公开(公告)日: 2009-08-20
- 发明人: Brian S. Doyle , Ravi Pillarisetty , Robert S. Chau
- 申请人: Brian S. Doyle , Ravi Pillarisetty , Robert S. Chau
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L29/78
摘要:
Fin field-effect-transistor (finFET) structures having two dielectric thicknesses are generally described. In one example, an apparatus includes a semiconductor substrate, a semiconductor fin coupled with the semiconductor substrate, the semiconductor fin having at least a first surface, a second surface, and a third surface, the third surface being substantially parallel to the first surface and substantially perpendicular to the second surface, a spacer dielectric coupled to the second surface of the semiconductor fin, a back gate dielectric having a back gate dielectric thickness coupled to the first surface of the semiconductor fin, and a front gate dielectric having a front gate dielectric thickness coupled to the third surface of the semiconductor fin wherein the back gate dielectric thickness is greater than the front gate dielectric thickness
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