An integrated circuit and method of fabricating an integrated circuit. One embodiment includes a circuit chip, a contact pad, and a projecting top contact. A signal line couples the contact pad to the projecting top contact, the contact pad, the projecting top contact. The signal line is arranged on a top face of the circuit chip. A substrate and a lower contact pad, the lower contact pad is arranged on a bottom face of the substrate and the circuit chip is arranged on a top face of the substrate. A bottom face of the circuit chip is facing the top face of the substrate. A connection couples the contact pad on the circuit chip to the lower contact pad.