An electrical test lead probe for use with a multi-meter provides for releasable retention in and electrical contact with a terminal of an industrial terminal block. The test lead probe includes a shortened body having an electrically conducting tip that is configured for releasable receipt into a terminal block socket of an industrial terminal block, the terminal block socket housing a terminal of the terminal block. The present terminal block probe, in one form, is permanently attached to a multi-meter test lead. In another form, the present terminal block probe is coupled to a modular multi-meter test lead. In yet another form, the present terminal block probe has a removable head incorporating an electrically conducting tip wherein the body is permanently attached to a multi-meter test lead. In a modular form, a plurality of terminal block probes may be provided each one of which has an electrically conducting tip of a different configuration corresponding to different configurations and/or sizes of industrial terminal block sockets.